Board-to-Board Plug Connector Reinforcement Against Solder Wick
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Solution Overview
Problem
Miniaturization of board-to-board connectors leads to durability issues and unstable electrical connections due to deformation and solder wick problems during press-fitting, especially with increased power requirements.
Innovation Solution
A plug connector design featuring over-molded fitting nails with central and lateral reinforcement portions and solder portions that prevent solder wick formation, providing multiple power terminals for stable electrical contact and enhanced durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the connector is miniaturized and has a low profile, then the connector size is reduced, but durability of the connector is degraded
Solution Approach 1:
The fitting nail is segmented into multiple functional portions: an upper surface for contact, a central reinforcement portion curved downward, lateral reinforcement portions extended from both ends, and solder portions. This segmentation allows each portion to perform its specific function optimally while maintaining overall compactness.
Solution Approach 2:
The fitting nail structure is nested within the connector body, with the central reinforcement portion curved downward to contact the outer surface of the first sidewall, and lateral reinforcement portions contacting the second sidewall. This nested arrangement maximizes structural efficiency within minimal space.
2Stability of the object's composition
If fitting nails are positioned at both ends of the connector, then press-fitting stability is improved, but the connector body may be easily deformed or broken due to relative position misalignment
Solution Approach 1:
The fitting nail has different local qualities in different portions: the central reinforcement portion contacts the outer surface of the first sidewall, while lateral reinforcement portions contact the second sidewall. This localized contact distribution improves press-fitting stability without concentrating stress that could cause deformation.
3Power
If the number of power terminals of the fitting nails is increased, then power current supply capability is improved, but solder wick occurrence becomes more likely during SMT process
Solution Approach 1:
The harmful function of the fitting nail surface is extracted and eliminated by applying a solder resist coating to the upper surface and lateral reinforcement portions. This allows the fitting nail to provide multiple power terminals while preventing solder wick occurrence during the SMT process.
Solution Approach 2:
A solder resist coating is introduced as an intermediary layer between the fitting nail metal surface and the solder material. This intermediary prevents direct interaction between solder and the fitting nail, eliminating the solder wick problem while allowing multiple power terminals to function.
Data Source
AI summary
A plug connector according to an embodiment includes: a connector main body which includes one pair of first sidewalls extended in a first direction and facing each other, and one pair of second sidewalls extended in a second direction perpendicular to the first direction, and facing each other; one pair of fitting nails which are coupled to the connector main body; and a plurality of plug terminals which are coupled to the one pair of second sidewalls, wherein each of the one pair of fitting nails includes: an upper surface which is in contact with an upper end of the first sidewall; a central reinforcement portion which is curved downward from the upper surface to come into contact with at least a portion of an outer surface of the first sidewall; and one pair of lateral reinforcement portions which are extended from both ends of the upper surface in the second direction to come into contact with an upper end of the second sidewall, wherein the central reinforcement portion includes a central solder portion which is extended downward from a lower end of the central reinforcement portion and encloses at least a portion of a lower surface of the first sidewall, wherein each of the one pair of lateral reinforcement portions includes: a first outer wall terminal which is extended downward; a second outer wall terminal which is spaced apart from the first outer wall terminal in the second direction and is extended downward; and a first inner wall terminal which is spaced inward from the second outer wall terminal and is extended downward, wherein each of the one pair of lateral reinforcement portions includes a lateral solder portion which is extended downward from at least one of the first and second outer wall terminals and encloses at least a portion of a lower surface of the second sidewall.