Plug-in Card Sensing Circuit for Non-Invasive Signal Probing
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Solution Overview
Problem
Existing systems fail to effectively sense and test signals within host devices, such as digital cameras and smartphones, without physically accessing the internal sensing points, which is necessary for ensuring the proper functioning of integrated circuits and memory chips.
Innovation Solution
A plug-in card with integrated sensing circuits and additional layers for RF and ground signal communication, allowing for the observation of internal signals using RF connectors and oscilloscope probing, enabling signal measurement without opening the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If physical access to internal sensing points is required for signal testing, then measurement precision is improved, but device complexity and ease of operation deteriorate due to the need to open the device and perform complicated measurements
Solution Approach 1:
The patent introduces an intermediary sensing circuit board that interfaces between the host device and external measurement equipment. This board includes RF connectors and communication mediums that mediate the signal transmission, allowing external oscilloscopes to measure internal signals without direct physical access to the device's internal sensing points. The intermediary board translates internal signals into measurable forms while maintaining signal integrity.
Solution Approach 2:
The patent adds an additional dimensional layer by integrating a separate sensing circuit board that extends outside the host device. This extra layer provides external access points (RF connectors) that enable measurement from an external dimension, eliminating the need to open the device and access internal points directly. The sensing board creates a new measurement dimension that bridges the internal-external boundary.
2Measurement precision
If physical access to internal sensing points is required for signal testing, then measurement precision is improved, but device complexity worsens due to the need to open the device
Solution Approach 1:
The patent segments the testing system into distinct functional modules: the host device, the sensing circuit board, and external measurement equipment. The sensing board itself is segmented into multiple layers including RF connector layers, communication medium layers, and ground communication medium layers. This segmentation allows each component to be optimized independently and simplifies the overall device structure by distributing functionality across separate modules.
Solution Approach 2:
The sensing circuit board is designed with a nested multi-layer structure where RF connectors, communication mediums, and ground communication mediums are arranged in concentric or stacked layers. The RF connector layer is nested with the communication medium layer, which is in turn nested with the ground communication medium layer. This nested architecture consolidates multiple functions into a compact integrated structure that adds minimal complexity to the host device.
3Ease of operation
If extra layers and extensions are added to the plug-in card for sensing, then ease of operation is improved by enabling non-invasive testing, but device complexity worsens due to additional components
Solution Approach 1:
The sensing circuit board is designed as a universal interface that can measure multiple types of signals (RF signals, ground signals, communication signals) through a single integrated structure. The RF connectors and communication mediums are configured to handle various signal types simultaneously, making the plug-in card a multi-functional measurement tool that simplifies operation by consolidating multiple measurement capabilities into one device.
Data Source
AI summary
A circuit system for testing a chip is provided. The circuit system includes a first layer coupled with a plurality of ground communication mediums. Each ground communication medium facilitates communication of a ground signal. The circuit system includes a second layer coupled with a first integrated circuit chip. The second layer is coupled with a plurality of radio frequency (RF) communication mediums. The RF communication mediums facilitate communication of RF signals. The first integrated circuit chip communicates via one of the RF signals and the ground signal with a second integrated circuit chip. The first and second layers are used to probe the RF signals and the ground signal.