Plug-in Connector Thermal Management via Peltier Cooling
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Solution Overview
Problem
Existing plug-in connectors face challenges in dissipating heat effectively in closed systems, leading to high power loss and reduced serviceable life due to excessive temperature limits, as air circulation is hindered, causing the electronic system to overheat and potentially fail.
Innovation Solution
A compact plug-in connector design incorporating a thermally conductive cooling element, preferably made of copper, with a U-shaped configuration and a spacer and gap filler to efficiently dissipate heat away from the circuit board, ensuring stable positioning and preventing overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a gap between housing base and mounting surface is used to ensure air circulation for cooling, then cooling effectiveness is improved, but device size increases
Solution Approach 1:
The patent replaces the mechanical air circulation cooling system with a thermoelectric cooling element (Peltier element) that actively pumps heat away from the circuit board. This substitution eliminates the need for large gaps for air circulation while achieving effective cooling through solid-state thermoelectric conversion.
Solution Approach 2:
The patent changes the cooling mechanism from passive air convection to active thermoelectric cooling. By applying electrical current to the Peltier element, the thermal parameters are dynamically controlled, allowing heat pumping without requiring physical space for air flow paths.
2Temperature
If the housing base is made very large to dissipate heat, then heat dissipation is improved, but device size increases
Solution Approach 1:
The patent replaces passive thermal conduction through a large housing base with an active thermoelectric cooling system. The Peltier element directly pumps heat from the circuit board to a heat sink, eliminating the need for an oversized housing base for heat dissipation.
Solution Approach 2:
The patent segments the thermal management function into distinct components: a cooling element for active heat pumping, a heat sink for heat dissipation, and thermal coupling elements. This segmentation allows compact integration of cooling functions without requiring a uniformly large housing base.
3Temperature
If fans and cooling bodies are used for cooling, then cooling function is improved, but device complexity increases
Solution Approach 1:
The patent replaces mechanical fans and complex cooling bodies with a solid-state thermoelectric cooling element. This substitution eliminates moving parts, reduces mechanical complexity, and integrates cooling functionality directly into the circuit board assembly through soldered thermal coupling.
Solution Approach 2:
The patent merges the cooling element, heat sink, and thermal coupling components into an integrated cooling assembly that is directly mounted on the circuit board. This consolidation reduces the number of separate cooling components and simplifies the overall cooling system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat from the circuit board, preventing temperature limits from being exceeded, thereby increasing the serviceable life of the electronic system and maintaining a compact, space-saving construction.
Implementation Method 1
The plug-in connector (1, 2, 3) comprises a cooling element (2). The cooling element is used to dissipate heat.
Data Source
AI summary
A plug-in connector with a plug side and a connector side is provided, the plug-in connector comprising a housing, a frame, and at least one contact insert. The contact insert comprises sensors and a circuit board with electronics. According to prior art, the risk of overheating of the electronics, occurring inside the plug-in connector as a result of power dissipation, is a reason for the failure of plug-in connectors known to date. Embodiments described herein ensure heat dissipation via a cooling element so that overheating is prevented.