Plug-in Power Module Vertical Heat Sink Design
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Solution Overview
Problem
Small power modules, such as Intelligent Power Modules (IPMs), face challenges in heat dissipation due to their compact size, requiring large cooling fins and experiencing difficulties in aligning heat sinks during assembly.
Innovation Solution
A plug-in type power module design featuring a heat-transfer unit extending outwardly from the power unit with a ceramic layer, printed circuit structure, or thick copper layer to enhance heat dissipation, along with a substrate slot system for easy assembly and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a bare copper structure such as exposed Direct Bonded Copper (DBC) is used for heat dissipation in small power modules, then the heat dissipation function is provided, but the cooling capacity is relatively limited due to the small volume
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending cooling fins vertically from the heat sink base. This dimensional change allows the heat dissipation structure to extend outwardly away from the power module in the vertical direction, significantly increasing the heat dissipation surface area without proportionally increasing the module's horizontal footprint.
Solution Approach 2:
The heat dissipation structure is segmented into multiple cooling fins that are extended from the heat sink base. Each fin acts as an independent heat dissipation element, collectively providing large surface area for heat transfer to the surrounding environment. This segmentation allows efficient heat dissipation within a compact volume.
2Reliability
If the overall structure of the small power module is formed by mold encapsulation, then the components are protected and integrated, but only connection terminals and pins are exposed making it difficult to align the heat sink to the power module during assembly
Solution Approach 1:
The power module is pre-equipped with an exposed heat sink structure and positioning features before final assembly. The heat sink with cooling fins is integrated into the module housing with exposed surfaces and alignment features that facilitate proper positioning and alignment during the assembly process, eliminating the need for complex alignment operations after encapsulation.
Solution Approach 2:
The patent introduces positioning features such as positioning holes, positioning protrusions, or positioning grooves as intermediary elements between the power module and the housing or mounting structure. These positioning features serve as mediators that guide and ensure accurate alignment during assembly, while the mold encapsulation continues to provide protection for the internal components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases heat dissipation efficiency and simplifies the assembly process by providing a larger heat dissipation area and facilitating quick plug-in and removal of the power module, improving both cooling effectiveness and maintenance ease.
Implementation Method 1
heat generated by the power unit is transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation
Implementation Method 2
a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit
Data Source
AI summary
A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.