Plugboard Heat Dissipation via Trapezoid Edge and Front Intake
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Solution Overview
Problem
The existing orthogonal structure of electronic communications devices limits the heat dissipation capability of rear boards due to complex air ducts with high system resistance, requiring high-performance fans and restricting the number of output ports, especially when multiple optical interfaces are involved.
Innovation Solution
A plugboard heat dissipation system is designed with a right-angled trapezoid shape, where the length of the hypotenuse board edge is greater than the right-angle side, allowing for more output ports and incorporating a heat dissipation vent on the enclosure's end face, with an air supply apparatus providing efficient airflow for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air ducts are disposed on both sides of the rear board to enable heat dissipation, then heat dissipation function is achieved, but the air ducts become complex with long paths and large system resistance, limiting heat dissipation capability
Solution Approach 1:
The patent extracts the air duct structure from the rear board design, eliminating the need for complex internal air ducts. Instead, air ducts are disposed on both sides of the front board, and air is taken in from the front board's sides to flow directly to heat dissipation components on the rear board, simplifying the overall air duct configuration and reducing system resistance.
Solution Approach 2:
The patent changes the spatial arrangement of heat dissipation components from being embedded within the rear board to being positioned on the rear board surface, accessible from the front board side. This dimensional repositioning allows for simpler air duct routing and reduces the path length for air flow.
2Temperature
If high-performance fans are used to meet heat dissipation requirements, then heat dissipation capability is improved, but system complexity and power consumption increase
Solution Approach 1:
The patent extracts the high-power fan requirement by redesigning the air duct system to have lower resistance. By simplifying the air duct configuration and shortening the air path, the system achieves effective heat dissipation with lower fan power consumption, eliminating the need for high-performance fans.
3Temperature
If air duct space is reserved on both sides of the rear board, then heat dissipation function is achieved, but dimensions of the rear board are restricted, limiting the number of output ports
Solution Approach 1:
The patent extracts the air duct space requirement from the rear board by relocating the air ducts to be disposed on both sides of the front board. This allows the rear board to utilize its full surface area for output ports and other components without reserving space for air ducts, maximizing the number of output ports.
4Adaptability or versatility
If multiple optical interfaces are disposed on the rear board, then functionality is improved, but cascaded heating occurs between panel interfaces, making it difficult to dissipate heat from downstream ports
Solution Approach 1:
The patent segments the heat dissipation approach by providing separate heat dissipation vents on different faces of the enclosure. Air is introduced from the front board sides and directed to specific heat dissipation vents, creating independent heat dissipation paths for different regions of the rear board, including multiple optical interfaces, thereby preventing cascaded heating effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design expands the number of ports on the plugboard by utilizing the increased length of the hypotenuse edge for output ports and enhances heat dissipation efficiency, reducing the need for high-power fans and minimizing cascaded heating issues.
Implementation Method 1
an air supply apparatus that provides an air source for heat dissipation
Implementation Method 2
a heat dissipation vent is disposed on an end face of the enclosure
Data Source
AI summary
A plugboard heat dissipation system is provided. The system may include a plugboard, an enclosure, and an air supply apparatus that provides an air source for heat dissipation, a length of a first board edge on the plugboard is greater than a length of a second board edge, an output port is disposed on the first board edge, a spatial position of the second board edge is corresponding to that of the first board edge, a connecting part connected to another plugboard orthogonal to the plugboard is disposed, the output port is output out of an enclosure using a first end face of the enclosure, the connecting part is output out of the enclosure using a second end face of the enclosure. In the system, when space in which the plugboard is located is limited, the number of ports on the plugboard can be expanded.