Pluggable Base Assemblies With Varying Redundancy Levels
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Solution Overview
Problem
Current process monitoring systems face challenges in efficiently managing varying levels of redundancy for assets and measurements of different criticality, leading to increased costs and complexity due to the need for extensive external wiring and large footprint requirements.
Innovation Solution
The use of pluggable base assemblies with varying levels of redundancy, connected through internal circuitry, reduces external wiring and optimizes space by integrating redundant modules within a compact system, allowing for flexible mixing of simplex and redundant configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete wires or cables are used to connect modules with varying redundancy levels, then system flexibility and adaptability are improved, but device complexity and probability of failure increase due to extensive external wiring
Solution Approach 1:
The patent merges multiple discrete wiring connections into a single integrated backplane structure. Modules with different redundancy levels (simplex, dual, triple) are connected through common backplane circuitry rather than discrete wires, reducing wiring complexity while maintaining system flexibility. The backplane serves as a unified communication and power distribution medium for all modules.
Solution Approach 2:
The backplane is designed as a universal interface that can accommodate modules with varying redundancy requirements. A single backplane structure provides multiple functions: power distribution, data communication, and module interconnection for different redundancy configurations (1x, 2x, 3x modules), eliminating the need for separate wiring schemes for each module type.
2Reliability
If TMR capable backplane and interface module infrastructure is provided for all modules, then reliability is improved, but cost increases as all modules share the expense of redundant capable infrastructure
Solution Approach 1:
The system implements local quality by allowing each module to have its own redundancy level (simplex, dual, or triple) while sharing the backplane infrastructure. Instead of making all modules TMR-capable, each module is configured with the appropriate redundancy level for its specific application, reducing overall system cost while maintaining reliability where needed.
Solution Approach 2:
The patent applies partial redundancy by providing TMR-capable backplane infrastructure only for modules that require it, rather than over-provisioning all modules with full TMR capability. Simplex and dual modules share the backplane without requiring full TMR infrastructure, achieving cost-effective reliability through selective application of redundancy.
3Adaptability or versatility
If external break out board is used to bus sensor signals across multiple modules, then adaptability is improved, but device complexity increases due to large number of external wires
Solution Approach 1:
The patent combines multiple sensor signal routing paths into the integrated backplane structure. Instead of using external break out boards and discrete wires to bus signals across modules, the backplane provides internal circuitry that routes sensor signals to multiple modules simultaneously, reducing external wire count while maintaining signal routing flexibility.
4Reliability
If TMR processing modules are provided for all measurements, then reliability is improved, but cost increases due to three high-power redundant processing modules regardless of whether all measurements need redundant processing
Solution Approach 1:
The system applies local quality by providing TMR processing capability only for specific measurements that require high reliability, rather than forcing all processing modules to be TMR-capable. Different processing modules can have different redundancy levels based on the criticality of the measurements they handle, reducing the number of high-power redundant processing modules needed.
5Reliability
If space is reserved for redundant I/O modules in the system, then reliability is improved, but footprint space requirements increase
Solution Approach 1:
The backplane is designed as a universal platform that can accommodate I/O modules with different redundancy levels (simplex, dual, triple) in the same physical space. By using the same backplane infrastructure for all module types, the system achieves I/O redundancy without increasing footprint space, as modules with varying redundancy requirements share the same mounting area and communication resources.
Data Source
AI summary
Apparatus includes a plurality of terminal base assemblies each having at least one module, at least some of the plurality of terminal base assemblies having varying levels of redundancy in the at least one module, the plurality of terminal base assemblies being connected together by circuitry within each of the plurality of terminal base assemblies.