Pluggable Heat Source Housing With Heat Conduction Sheet Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The gap around pluggable electronic elements in electronic devices creates an air layer with high thermal resistance, leading to poor heat dissipation when the elements are plugged in.

Innovation Solution

A housing with an accommodating groove and inclined surface, combined with a heat conduction sheet and thin film, guides the pluggable heat source for direct heat dissipation and stabilizes the insertion process, minimizing contact with the thin film during plugging/unplugging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a gap is reserved around the pluggable electronic element to ensure smooth insertion, then the ease of operation is improved, but the heat dissipation performance deteriorates due to the formation of an air layer with high thermal resistance

Engineering Contradiction:
Improvesmooth insertionVSAvoidheat dissipation performance
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

A heat conduction sheet is introduced as an intermediary substance between the pluggable electronic element and the housing. This sheet fills the gap that was previously filled with air, providing both thermal conduction pathways and maintaining the necessary clearance for smooth insertion. The heat conduction sheet has thermal conductivity significantly higher than air, thus resolving the thermal resistance issue while preserving the operational ease benefit of having a gap.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The thermal conductivity parameter of the medium in the gap is changed from air (low thermal conductivity) to heat conduction sheet material (high thermal conductivity). This parameter change transforms the thermal properties of the gap-filling material while maintaining the geometric gap structure, thereby improving heat dissipation without affecting the mechanical clearance needed for smooth insertion.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the heat conduction sheet is placed in direct contact with the pluggable heat source, then the heat dissipation efficiency is improved, but the risk of damage to the thin film during insertion increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidthin film integrity
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat conduction sheet is pre-positioned in the housing before the pluggable heat source is inserted. The sheet is arranged to extend across the insertion path, creating a protective barrier that guides the heat source into its final position. This preliminary arrangement ensures that the heat source makes controlled contact with the heat conduction sheet rather than directly with the thin film, preventing damage while establishing thermal contact.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The heat conduction sheet serves as a mediator between the pluggable heat source and the thin film structure. During insertion, the heat source contacts the heat conduction sheet first, which then transfers the thermal contact force in a controlled manner, preventing direct impact on the thin film. This intermediary role allows efficient thermal coupling while protecting the fragile thin film from mechanical damage.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation effects and ensures smooth plugging/unplugging of the heat source by maintaining structural stability and preventing damage to the thin film, thereby improving thermal performance.

Implementation Method 1

a heat conduction sheet and a pluggable heat source. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface... The heat conduction sheet is accommodated in the accommodating groove

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20260040496A1Heat dissipation structure and electronic device
Publication Date: 2026.02.05 GETAC TECH CORP
  • US20260040496A1 patent drawing
  • US20260040496A1 patent drawing
  • US20260040496A1 patent drawing

AI summary

An electronic device includes a housing, a heat conduction sheet and a pluggable heat source. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface. The accommodating groove is recessed on the supporting surface. The inclined surface is connected to the supporting surface, and is located on one side of the accommodating groove. The heat conduction sheet is accommodated in the accommodating groove, and a surface of the heat conduction sheet is in aligned with a surface of the supporting surface. The pluggable heat source is arranged on the supporting surface and the heat conduction sheet.