Pluggable Lead Semiconductor Package for Solder-less Connections

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Solution Overview

Problem

Conventional power semiconductor transistor packages require separate leads for each terminal, increasing package size and cost, and are limited by the need for soldering, which restricts their use in applications where solder-less connections are necessary.

Innovation Solution

A semiconductor package with a pluggable lead that provides separate electrical pathways for multiple terminals of the semiconductor die, allowing for soldered or solder-less connections by inserting into an external receptacle, eliminating the need for multiple leads and enabling use in applications where soldering is not permitted.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate leads are used for each terminal of the semiconductor die, then electrical connections are provided, but package size and cost increase

Engineering Contradiction:

Improveelectrical connectionsVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

Multiple separate leads are merged into a single pluggable lead structure that provides multiple electrical pathways. The pluggable lead integrates multiple conductive elements (such as multiple barrels or contact points) that each connect to different terminals of the semiconductor die, thereby reducing the number of discrete leads required while maintaining all necessary electrical connections.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The pluggable lead is designed to perform multiple functions simultaneously - it provides electrical connections for multiple terminals (source, gate, drain) through a single component. This multi-functional design allows one lead structure to replace what would traditionally require multiple separate leads, reducing overall package complexity and size.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If conventional leads are used, then electrical connections are provided, but soldering is required which limits application use

Engineering Contradiction:

Improveelectrical connectionsVSAvoidapplication compatibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The soldering process (thermal/mechanical joining method) is replaced with a pluggable mechanical insertion system. The pluggable lead features a receptacle or connector design that mechanically engages with a corresponding socket or mounting structure on the circuit board or heat sink, eliminating the need for soldering while providing reliable electrical and mechanical connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If multiple separate leads are used, then each terminal is connected, but lead count and complexity increase

Engineering Contradiction:

Improveterminal connectionsVSAvoidlead configuration

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9153518B2Molded semiconductor package with pluggable lead

Publication Date: 2015.10.06 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor package includes a semiconductor die having a plurality of terminals, a molding compound encapsulating the semiconductor die, and a pluggable lead dimensioned for insertion into an external receptacle. The pluggable lead protrudes from the molding compound and provides a separate electrical pathway for more than one terminal of the semiconductor die. The separate electrical pathways of the pluggable lead can be provided by electrical conductors isolated from one another by electrical insulator such as molding compound or other insulation material/medium.