Pluggable Light Source for Silicon Photonics PHY Chip

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Solution Overview

Problem

The integration of a light source into silicon photonics systems on printed circuit boards (PCBs) leads to costly replacements due to reliability issues and expensive packaging, especially when highly specialized SFP optical modules are required for specific data rates, and there is a need for a more flexible and cost-effective solution for modulating optical signals.

Innovation Solution

A pluggable light source device with a plug-in interface that connects to a silicon photonics PHY chip on the PCB, allowing for easy installation and removal of light sources, utilizing a frictional or sliding mechanical connection for both electrical and optical coupling, enabling the use of a single light source to provide optical signals to multiple chips and facilitating the exchange of light sources without requiring further securing connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If light sources are integrated into the PCB or PHY chip, then the system achieves compact integration and improved performance, but the cost of replacement increases significantly and reliability decreases due to failure risks

Engineering Contradiction:
Improveintegration capabilityVSAvoidsystem reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The system is divided into separate functional modules: the light source is packaged as a distinct module that can be independently replaced, while the PCB and PHY chip remain separate. This segmentation allows the light source to be exchanged without replacing the entire system, maintaining reliability while achieving integration benefits.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A specialized light source package serves as an intermediary component between the light source and the PCB/PHY chip. This package includes mounting structures and electrical connections that facilitate easy installation and removal, enabling the light source to be replaced without affecting the PCB or PHY chip integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If highly specialized SFP optical modules are used for specific data rates, then modulation performance is optimized, but the device complexity and cost increase

Engineering Contradiction:
Improvemodulation performanceVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The light source package is designed with universal mounting features and standardized electrical connections that can accommodate different light source types and data rate requirements. This universality allows a single package design to support multiple functions and configurations, reducing the need for highly specialized modules for each data rate.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system allows for parameter changes by enabling the replacement of light sources with different characteristics (wavelength, power, modulation capabilities) while maintaining the same physical package and mounting structure. This approach optimizes performance for different data rates without requiring completely specialized modules.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If light sources are packaged within the PHY chip, then integration is achieved, but the packaging cost increases and replacement becomes difficult

Engineering Contradiction:
Improveintegration levelVSAvoidpackaging cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The light source packaging is segmented into a separate module that attaches to the PCB rather than being embedded within the PHY chip. This segmentation reduces packaging complexity and cost while maintaining integration benefits, as the light source package is a standalone component that can be manufactured and tested independently.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The light source is extracted from the PHY chip integration and placed in a separate package mounted on the PCB. This extraction simplifies the packaging process, reduces manufacturing costs, and enables easy replacement of the light source without affecting the PHY chip or requiring complex re-packaging operations.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS9116313B2Silicon photonics structures with pluggable light sources
Publication Date: 2015.08.25 CISCO TECHNOLOGY INC
  • US9116313B2 patent drawing
  • US9116313B2 patent drawing
  • US9116313B2 patent drawing

AI summary

A pluggable light source device connects in a plug-in engaging manner with an optical modulating device that includes an optical modulator component. The pluggable light source includes a light generator to generate an optical signal to be output from the light source device, and a connection member disposed at a connecting end of the light source device. The connection member includes an optical connector, where the optical connector of the light source device is configured to engage with a corresponding optical connector of the optical modulating device when the connecting end of the light source device is connected via a plug-in engagement with a connection member of the optical modulating device so as to facilitate input of optical signals from the light generator to the optical modulator component.