Pluggable Module Cooling Interface for Low-Force Liquid Coupling
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Solution Overview
Problem
Liquid cooling of pluggable modules in information processing devices is challenging due to the need for removable connections that are costly, prone to leakage, and difficult to establish a good thermal interface without damaging thermal interface materials or requiring excessive insertion forces.
Innovation Solution
A pluggable module cooling assembly with a cooling interface block and heat transfer device that uses a compliant thermal interface module with a thin protective cover and gap pad to thermally couple the module to liquid coolant, allowing for good thermal conductivity without high contact pressures or damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented for pluggable modules, then cooling efficiency is improved, but connection reliability deteriorates due to leakage and difficulty in establishing thermal interface
Solution Approach 1:
The cooling interface is divided into separate components: a cooling interface block with cooling channels, a heat transfer device with heat pipes, and a thermal interface module. This segmentation allows each component to be optimized independently while maintaining reliable thermal coupling through standardized interfaces.
Solution Approach 2:
A thermal interface module serving as an intermediary component is introduced between the heat transfer device and the cooling interface block. This intermediary includes a compliant layer that maintains consistent thermal contact and a protective cover that prevents leakage, thereby improving connection reliability while maintaining cooling efficiency.
2Reliability
If high contact pressures are applied to establish thermal interface, then thermal conductivity is improved, but ease of operation deteriorates due to excessive insertion forces
Solution Approach 1:
The physical state and properties of the thermal interface materials are optimized by using compliant layers with specific durometer ranges (10-50 Shore A) and controlling the thickness of interface elements. This allows the materials to deform and conform to mating surfaces under minimal insertion forces while maintaining adequate thermal contact pressure for effective heat transfer.
Solution Approach 2:
Compliant layers and thin film structures are used in the thermal interface module to provide flexibility and conformability. These flexible elements can deform under low insertion forces to establish good thermal contact, eliminating the need for high contact pressures while maintaining thermal conductivity.
3Reliability
If thermal interface materials are used to improve thermal coupling, then thermal conductivity is improved, but manufacturing precision deteriorates due to damage during insertion and removal
Solution Approach 1:
The thermal interface module is designed as a replaceable component that can be easily installed and removed without damaging the underlying thermal interface materials. The modular design allows the interface module to be replaced rather than repaired, maintaining thermal conductivity while protecting the materials from mechanical damage during handling.
Solution Approach 2:
The thermal interface module acts as a protective intermediary layer between the heat transfer device and cooling interface block. It includes a protective cover that shields the thermal interface materials from mechanical damage during insertion and removal operations, while still allowing effective thermal coupling to occur.
4Adaptability or versatility
If removable connections are made for pluggable modules, then adaptability is improved, but loss of substance increases due to leakage
Solution Approach 1:
The cooling system is segmented into modular components with dedicated sealing interfaces. The cooling interface block, heat transfer device, and thermal interface module are separated with defined mating surfaces that include sealing features, allowing easy connection and disconnection while preventing coolant leakage through proper sealing design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient heat transfer from pluggable modules to liquid coolant without the need for high insertion forces and protects the thermal interface material from damage, facilitating easy installation and removal.
Implementation Method 1
a heat transfer device thermally coupled to the cooling interface block when the pluggable module is installed in the bay
Implementation Method 2
a liquid cooling subsystem that includes liquid coolant in thermal communication with the cooling interface block
Data Source
AI summary
An information processing system comprises a chassis defining a bay, a system board supported by the chassis, and a local liquid cooling subsystem supported by the chassis. The local liquid cooling subsystem is configured to circulate liquid coolant through the information processing system and comprises a cooling interface block thermally coupled to the liquid coolant. The cooling interface block comprising a slot. The system also comprises a pluggable module removably received in the bay. The pluggable module comprises a heat transfer assembly comprising a tab. The tab is removably received in the slot of the cooling interface block. The system also comprises a cooling interface module disposed in the slot between the tab and walls of the slot. The cooling interface module comprising a gap pad and a thermally conductive protective cover attached to the gap pad. The cooling interface module thermally couples the tab to the cooling interface block.