Pluggable Electronic Modules with Supplemental Ventilation Ports

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Solution Overview

Problem

Existing electronic devices face challenges in concurrently meeting thermal, electromagnetic interference (EMI), and security standards like FIPS, as cooling upgrades can compromise EMI and security compliance.

Innovation Solution

The implementation of thermal, EMI, and FIPS friendly electronic modules with supplemental ventilation ports that augment the air stream within the system, ensuring robust compliance with all requirements through a chassis design that includes a fan and filter assembly, and modularized components with EMI shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling resources are upgraded to accommodate faster, higher power components, then thermal management improves, but EMI and FIPS compliance deteriorates

Engineering Contradiction:

Improvethermal managementVSAvoidEMI and FIPS compliance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The cooling system is segmented into multiple independent pathways: primary cooling ducts for general thermal management and supplemental ventilation ports integrated into electronic modules for localized cooling. This segmentation allows thermal management to be improved without compromising the integrity of EMI shielding and FIPS compliance in critical areas.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the electronic system are provided with different cooling solutions tailored to their specific thermal and compliance requirements. Critical modules requiring FIPS compliance use supplemental ventilation ports with EMI shielding, while non-critical areas use standard cooling ducts, thus achieving local optimization of both thermal management and compliance.

Inventive Principle:

Principle #3Local quality

2Temperature

If cooling ducts are made larger to improve airflow, then thermal management improves, but EMI leakage increases

Engineering Contradiction:

Improveairflow coolingVSAvoidEMI leakage

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The ventilation system is divided into standard cooling ducts for bulk airflow and supplemental ventilation ports integrated into individual electronic modules. Each module's supplemental port is equipped with EMI shielding, allowing larger effective airflow area while maintaining EMI protection at critical interfaces.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

EMI shielding materials are introduced as intermediary elements within the supplemental ventilation ports. These shielding elements mediate between the need for increased airflow (thermal management) and the need to prevent EMI leakage, allowing air to pass through while blocking electromagnetic interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If modularized components with supplemental ventilation ports are implemented, then thermal management improves, but device complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidmodule configuration

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The supplemental ventilation ports are designed as universal components that can be integrated into multiple different electronic modules with varying thermal requirements. Each module can independently incorporate these ports, providing standardized thermal management enhancement without requiring complex system-wide redesign, thus balancing cooling efficiency improvement with controlled complexity increase.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable operation within prescribed temperature ranges while maintaining EMI and security standards, providing efficient cooling and compliance with thermal, EMI, and FIPS requirements.

Implementation Method 1

a cooling subsystem formed by fan and filter assemblies) which flows from an air intake side of the chassis to an air exhaust side of the chassis

Methodology Applied

Scientific EffectForced Convection: Forced Convection

Implementation Method 2

define a supplemental ventilation port through which air passes to augment the air stream

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

modularized components with EMI shielding

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20100020486A1Techniques utilizing thermal, EMI and FIPS friendly electronic modules

Publication Date: 2010.01.28 CISCO TECHNOLOGY INC

AI summary

An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.