Pluggable Inter-Chip Optical Connector for Relaxed Alignment Tolerances
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Solution Overview
Problem
Inter-chip optical couplers require precise alignment within sub-micron tolerances to ensure efficient light coupling and minimize insertion loss, but are challenged by misalignment, thermal expansion, and manufacturing variations.
Innovation Solution
The use of high tolerance grating couplers and alignment features in a pluggable inter-chip optical connector (PICOC) allows for relaxed alignment tolerances while maintaining high coupling efficiency, incorporating passive and active alignment elements to facilitate precise optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional electrical interconnects are used, then ease of manufacture is improved, but optical coupling efficiency deteriorates due to lack of precise alignment
Solution Approach 1:
The system is divided into two separate sub-assemblies (first and second sub-assemblies) that can be manufactured independently with standard tolerances, then connected through alignment features. This segmentation allows each sub-assembly to be manufactured easily while the connection mechanism provides the necessary precision.
Solution Approach 2:
Alignment features act as intermediary elements between the two sub-assemblies. These features include mechanical structures that physically guide and constrain the relative positioning, providing precise alignment without requiring ultra-precise manufacturing of the entire assembly.
2Manufacturing precision
If precision-molded connectors are used to achieve high alignment accuracy, then optical coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The alignment features are designed to self-align the sub-assemblies during assembly. The mechanical structures automatically guide the components into the correct relative positions without requiring complex external alignment equipment or multiple adjustment steps.
Solution Approach 2:
Multiple functions are merged into the alignment features, which simultaneously provide mechanical support, positioning guidance, and optical alignment. This consolidation reduces device complexity compared to having separate components for each function.
3Manufacturing precision
If active alignment techniques are used, then optical coupling efficiency is improved, but ease of operation deteriorates due to complex assembly procedures
Solution Approach 1:
Alignment features are pre-formed during the manufacturing process of each sub-assembly. This preliminary action ensures that when the sub-assemblies are brought together, the alignment is already established by the mechanical structures, eliminating the need for complex post-assembly alignment procedures.
4Manufacturing precision
If sub-micron alignment tolerances are required, then optical coupling efficiency is improved, but manufacturing cost increases
Solution Approach 1:
High precision is localized to the alignment features and grating coupler interface area, while the rest of the sub-assemblies can be manufactured with standard tolerances. This localized approach to precision reduces overall manufacturing cost compared to requiring sub-micron precision throughout the entire assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves efficient optical coupling with relaxed alignment tolerances, reducing manufacturing costs and improving reliability in high-speed data communication applications.
Implementation Method 1
a first high tolerance grating coupler element configured to interface with at least a second photonic chip
Implementation Method 2
applying a photoresist layer onto the surface of the substrate, wherein the photoresist is sensitive to a specific wavelength of light using in a lithography process, patterning the photoresists layer by exposing it to light through a photomask
Implementation Method 3
etching one or more exposed areas of the substrate, using an etching process to transfer the pattern from the photoresists on the substrate
Data Source
AI summary
An apparatus for pluggable inter-chip optical connector may include a first sub-assembly, including at least a first photonic chip, a first high tolerance grating coupler element configured to interface with at least a second photonic chip, and a first set of one or more alignment features, and a second sub-assembly including the at least a second photonic chip, wherein the at least a second photonic chip includes a sensing region, and a second set of one or more alignment features, wherein the second set of one or more alignment features are configured to plug into the first sub-assembly at the first set of one or more alignment features, wherein attaching the first sub-assembly to the second sub-assembly using the first set of alignment features and the second set of alignment features places the first high tolerance grating coupler in optical communication with the second high tolerance grating coupler.