Pluggable Optical Packaging Structure for Protected Fiber Alignment
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Solution Overview
Problem
Existing optical packaging structures face challenges in simplifying assembly difficulty and maintaining alignment accuracy due to exposed optical fibers, which can lead to fiber breakage and misalignment issues during the packaging process.
Innovation Solution
A pluggable optical packaging structure utilizing a substrate, carrier ring, optical connection assembly, and cover plate, with passive alignment methods and positioning grooves to enclose and shield optical fibers, reducing exposure and improving alignment efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are exposed in the initial optical packaging structure, then the optical signal transmission function is achieved, but the difficulty of packaging operations increases and the defect rate increases due to fiber breakage or damage
Solution Approach 1:
The patent extracts the optical fibers from the exposed state and encloses them within a protective housing structure. The optical fibers are routed through designated channels and protected by the housing, separating them from the external environment during packaging operations, thus reducing breakage risk while maintaining their transmission function
Solution Approach 2:
The patent implements preliminary protective measures by designing a housing structure that encloses and protects optical fibers before packaging operations begin. The housing includes protective channels and positioning features that prevent fiber damage in advance, counteracting the potential harm of fiber exposure during handling
2Measurement precision
If alignment accuracy requirements are strict, then the optical signal transmission quality is improved, but the assembly time increases and the process becomes more labor-intensive due to the need for precise alignment
Solution Approach 1:
The patent implements preliminary alignment features directly in the housing structure, including positioning grooves, alignment pins, and pre-positioned optical components. These features establish accurate alignment positions before the actual assembly process, eliminating the need for time-consuming manual alignment adjustments during packaging
Solution Approach 2:
The housing structure incorporates self-aligning mechanisms where components automatically position themselves through built-in alignment features such as tapered guides, snap-fit connections, and precision-machined mating surfaces. This self-service alignment reduces manual intervention and accelerates the assembly process while maintaining accuracy
3Reliability
If misalignment occurs on components, then the optical signal transmission is affected, but a lot of time is consumed to rectify the mistake which is time-consuming and labor-intensive
Solution Approach 1:
The patent incorporates adjustable and repositionable features in the housing structure, allowing misaligned components to be easily adjusted and repositioned. The housing includes movable mounting sections and adjustable positioning mechanisms that enable quick correction of alignment issues without requiring complete disassembly or extensive repair time
Data Source
AI summary
A pluggable optical packaging structure is provided, including: a substrate, a carrier ring, at least one optical connection assembly and a cover plate; the substrate includes at least one electronic integrated circuit (EIC) and at least one photonic integrated circuit (PIC); the carrier ring is located on the substrate, and the EIC and PIC are enclosed by the carrier ring; the optical connection assembly includes at least one socket, at least one connector, a plurality of optical fibers and at least one optical fiber array connector, the socket is located in a partial section of the carrier ring, the connector is in the socket, the optical fibers has one end coupled to the connector, the other end coupled to the fiber array connector, and is coupled to the PIC through the fiber array connector; the cover plate is located on the carrier ring and extends inwardly to above the PIC.