Pluggable Polymeric Sensor for Fluid Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensor devices for measuring properties and conditions of fluid substances in plastic applications are costly and inefficient due to the need for integration of silicon MEMS sensors, which increases costs and complicates integration into plastic products.
Innovation Solution
The development of pluggable sensor devices made from polymeric materials with embedded sensing elements, such as deformable substrates and transducer elements, that can be directly integrated into plastic products, eliminating the need for expensive semiconductor-based packaging and allowing for easy integration and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If silicon MEMS sensors are integrated into plastic products, then measurement precision is improved, but device complexity and manufacturing cost increase dramatically
Solution Approach 1:
The sensor device is divided into separate functional modules: a sensor element module containing the sensing component, and a housing module containing fluidic channels and mounting structures. This segmentation allows each module to be optimized and manufactured independently using appropriate processes, then assembled together, reducing overall device complexity while maintaining measurement precision.
Solution Approach 2:
Different regions of the device use different materials and structures optimized for their specific functions: the sensor element uses high-precision silicon or piezoresistive materials for accurate measurement, while the housing uses molded plastic for fluidic pathways and structural support. This local optimization maintains measurement precision where needed while reducing overall device complexity and cost.
2Measurement precision
If silicon MEMS sensors are integrated into plastic products, then measurement precision is improved, but manufacturing cost increases dramatically
Solution Approach 1:
By segmenting the device into independently manufacturable modules, the sensor element can be produced using cost-effective techniques such as screen printing, sputtering, or injection molding of piezoresistive elements, rather than requiring expensive semiconductor fabrication for the entire device. This maintains measurement precision while dramatically reducing manufacturing cost.
Solution Approach 2:
The invention enables the creation of disposable or low-cost sensor devices by using inexpensive materials and manufacturing processes for non-critical components. The sensor element itself maintains precision through careful design and material selection, while the housing and fluidic pathways use low-cost molded plastic, making the overall device economically viable for single-use or high-volume applications.
3Measurement precision
If sensor elements are packaged as standalone devices, then measurement precision is maintained, but integration into plastic products becomes complex and time-consuming
Solution Approach 1:
The sensor element is merged with the housing structure to form an integrated sensor assembly where the sensing component, fluidic channels, and mounting features are combined into a single unit. This merging eliminates separate packaging and integration steps, reducing integration time while maintaining measurement precision through protected sensor element design.
Solution Approach 2:
The sensor element is pre-mounted and sealed within the housing structure during housing fabrication, creating a pre-assembled sensor module ready for final installation. This preliminary action of pre-mounting the sensor element eliminates time-consuming assembly steps during product integration while maintaining measurement precision through proper sealing and positioning.
4Measurement precision
If conventional semiconductor-based sensors are used, then measurement precision is improved, but packaging costs account for 70-90% of total device cost
Solution Approach 1:
The invention extracts the sensor element from the expensive semiconductor packaging process and integrates it directly into a molded plastic housing. This extraction eliminates the need for separate packaging steps and materials, reducing packaging costs from 70-90% of total device cost to a minimal fraction, while maintaining measurement precision through direct mounting and sealing.
Solution Approach 2:
The device uses composite construction combining the sensor element material (silicon, metal foil, or piezoresistive polymer) with molded plastic housing materials. This composite approach allows the sensor element to maintain its precision characteristics while the plastic housing provides protective packaging functions at minimal cost, eliminating the need for expensive separate packaging layers and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in compact, cost-effective, and robust sensor devices that can measure multiple parameters with excellent measurement characteristics, enabling intuitive integration into plastic products and reducing costs by 70-90% compared to conventional semiconductor-based sensors.
Implementation Method 1
a deformable substrate, at least one transducer element formed on a surface area of a first side of the deformable substrate
Implementation Method 2
at least one other transducer element formed on a surface area of a second side of the deformable substrate
Data Source
AI summary
A sensor device for measuring properties and/or conditions of one or more fluid substances contained, or streamed, inside a fluid vessel, is disclosed. The sensor device generally comprises a main body portion an attachment portion. The main body portion comprises a cavity and at least one sensing element operatively mounted inside the cavity for measuring the properties and/or conditions of the one or more fluid substances and generating data/signals indicative thereof. The attachment portion comprises at least one fluid passage and it is configured to establish fluid communication between a cavity or lumen of the fluid vessel and the cavity of the main body portion through the at least one fluid passage, to thereby enable the one or more fluid substances to interact with the at least one sensing element upon attachment of said sensor device to the fluid vessel.