Pluggable Processor Module Assembly to Cut Power Loss and Board Warpage
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Solution Overview
Problem
Existing vertical power arrangements for processors require multiple reflow steps and can cause board warpage, complicating component installation and replacement, and often result in unintended effects on other board elements.
Innovation Solution
A self-contained module with a microprocessor package and voltage regulator, designed for easy plugging into a PCBA, minimizes power delivery path and allows independent replacement of components, reducing the need for solder reflow and minimizing board warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If voltage regulator and processor are bonded to opposite sides of board in vertical arrangement, then power delivery path is shortened and power loss is reduced, but board warpage occurs during installation
Solution Approach 1:
The system is divided into separate components: a processor card with processor and voltage regulator, and a motherboard with board. The voltage regulator remains on the processor card rather than being bonded to the motherboard, eliminating warpage while maintaining short power delivery path through direct connection on the same card.
Solution Approach 2:
The power delivery path is optimized by using vertical stacking and direct edge-to-edge connections between processor and voltage regulator on the processor card, achieving short power path without requiring thermal bonding across the board thickness that causes warpage.
2Device complexity
If two separate reflow steps are used to connect voltage regulator and component to board, then vertical power arrangement is achieved, but installation complexity increases
Solution Approach 1:
The voltage regulator and processor are pre-integrated on the same processor card as a unified assembly. This merging eliminates the need for separate reflow steps to attach the voltage regulator to the motherboard, reducing installation complexity to a single card insertion operation.
Solution Approach 2:
The voltage regulator is pre-positioned and connected to the processor on the processor card before final assembly. This preliminary integration of critical power delivery components simplifies the final installation process and reduces the number of heating cycles required.
3Ease of operation
If voltage regulator is located on same side of board as processor, then installation is simpler, but power delivery path becomes longer increasing power loss
Solution Approach 1:
The system separates the voltage regulator from the motherboard and keeps it integrated with the processor on the processor card. This segmentation maintains the short power delivery path advantage while simplifying installation to a single card-level operation rather than board-level component attachment.
Data Source
AI summary
A method includes forming a module aperture in a printed circuit board assembly (“PCBA”), forming an electronic communication interface extending around the module aperture, and plugging a pluggable processor module into the module aperture, the pluggable processor module comprising a micro-processor package, a voltage regulator, and a contact. An electronic communication interface of the pluggable processor module is placed in contact with the electronic communication interface of the PCBA.