Pluggable Module Socket Connector With Perpendicular Contact Mating
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Solution Overview
Problem
Existing communication systems with pluggable modules are limited by the contact density of card edge connectors, leading to signal degradation at higher speeds due to trace lengths between the connectors and integrated circuits.
Innovation Solution
An electrical connector system with a circuit card assembly that includes a host circuit board, an interposer, and a socket connector, featuring compressible socket contacts and a pluggable module with module contacts that mate perpendicularly to create circuit paths through the socket contacts, enhancing contact density and reducing signal degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If card edge connectors with two rows of contacts are used, then the device structure is simple and ease of manufacture is improved, but contact density is limited and signal degradation occurs at higher speeds
Solution Approach 1:
The patent transitions from a planar two-row contact arrangement to a three-dimensional stacked contact architecture. Multiple contact layers are arranged vertically, with lower contacts on the bottom surface, middle contacts in an intermediate layer, and upper contacts on the top surface. This vertical stacking enables significantly higher contact density while maintaining compact form factor and resolving the signal integrity issues associated with long trace lengths in planar configurations.
Solution Approach 2:
The patent implements nested contact layers where multiple contact arrays are positioned at different heights within the same connector housing. The lower, middle, and upper contact layers are nested vertically, allowing signals to be transmitted through multiple stacked PCBs simultaneously. This nesting approach maximizes contact density without increasing the horizontal footprint, thereby improving signal integrity by reducing trace lengths.
2Productivity
If contact density is increased to improve communication system density, then productivity and space utilization are improved, but signal degradation increases due to longer traces
Solution Approach 1:
By stacking contact layers vertically across multiple PCBs, the system achieves high contact density without extending trace lengths horizontally. The vertical arrangement allows signals to be transmitted through multiple layers simultaneously, maintaining short trace lengths on each individual PCB while increasing overall system capacity and productivity.
Solution Approach 2:
The connector is divided into multiple independent contact layers (lower, middle, upper) that can be implemented on separate PCBs. Each layer handles specific signal paths, allowing for optimized routing and reduced trace lengths on each segment. This segmentation enables high system density while maintaining signal integrity through shorter individual trace paths.
3Reliability
If multiple PCBs are stacked with multiple contact layers, then contact density is improved, but device complexity increases
Solution Approach 1:
The socket connector is designed as a universal interface that accommodates multiple contact layers and different module types. The same basic connector structure can interface with various module configurations, reducing the need for specialized connectors for each layer or application. This multi-functionality simplifies the overall system architecture despite the increased contact density.
Solution Approach 2:
Multiple contact layers and PCBs are merged into a single integrated connector assembly. The lower, middle, and upper contact arrays are combined within one socket connector housing, creating a unified interface that manages all connections simultaneously. This merging approach reduces the number of separate components and interfaces needed, thereby reducing overall device complexity while maintaining high contact density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high contact density and improved signal integrity by compressing socket contacts between the module and interposer, thereby reducing signal degradation at higher speeds.
Implementation Method 1
The socket contacts are compressible. The socket contacts have first mating ends and second mating ends. The first mating ends have separable mating interfaces at a module mating zone. The second mating ends have separable mating interfaces. The second mating ends are connected to the mating ends of the corresponding interposer contacts.
Data Source
AI summary
An electrical connector system includes a circuit card assembly having a host circuit board, an interposer, and a socket connector arranged in a circuit stack. The interposer includes interposer contacts on an interposer circuit board. The socket connector includes compressible socket contacts having mating ends with separable mating interfaces. The electrical connector system includes a pluggable module having a module circuit board held in a module body at the mating end configured to be loaded into the module mating zone in a module loading direction and mated with the socket contacts in a contact mating direction generally perpendicular to the module loading direction to compress the socket contacts between the module circuit board and the interposer contacts and create circuit paths between the module contacts and the interposer contacts through the socket contacts.