Pluggable Optical Transceiver Interface for Short IC Package Links

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Solution Overview

Problem

Conventional transceivers are not designed to be directly connected to IC packages, requiring extensive hardware for mechanical retention and alignment, leading to increased size, cost, and complexity due to lengthy copper connections and the need for optical components within the IC package, which limits miniaturization and increases bit error rates.

Innovation Solution

A transceiver with an optical engine that can be plugged directly into an IC package, using a zero-insertion-force connector system to transmit electrical signals directly through the IC circuit board, eliminating the need for optical components within the IC package and reducing hardware requirements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional transceivers are connected to IC packages through socket and PCB traces, then mechanical retention and alignment are achieved, but the connection path becomes lengthy (up to 20 inches) causing signal loss and increased bit error rate

Engineering Contradiction:
Improvesignal integrityVSAvoidconnection path length
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The invention segments the connection path by introducing an intermediate IC circuit board that directly receives electrical signals from the IC die and transmits them to the transceiver, eliminating the lengthy path through PCB traces and socket connections. This segmentation reduces the total connection length from 20 inches to a minimal distance, thereby improving signal integrity and reducing bit error rate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The IC circuit board acts as an intermediary component between the IC die and the transceiver. It provides a direct electrical connection path that bypasses the conventional socket-PCB-trace pathway, enabling short-distance signal transmission while maintaining mechanical retention and alignment through the socket connection to the host circuit board.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If optical components are included within the IC package, then optical-to-electrical and electrical-to-optical conversion is achieved, but the package size increases and manufacturing complexity increases

Engineering Contradiction:
Improveoptical conversion capabilityVSAvoidpackage structure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention extracts the optical conversion function from the IC package by placing the optical engine within the transceiver assembly. The IC package retains only its essential function of providing electrical signals to the IC die, while the transceiver handles optical-to-electrical and electrical-to-optical conversion. This extraction simplifies the IC package structure and reduces manufacturing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The optical conversion functionality is copied to the transceiver component, which is a separate module from the IC package. This allows the IC package to remain simple while the transceiver incorporates the optical engine and necessary optical components, achieving functional versatility without increasing IC package complexity.

Inventive Principle:
Principle #26Copying

3Strength

If conventional transceivers are used with mechanical retention hardware, then adequate mechanical retention is achieved, but the transceiver size increases and hardware requirements increase

Engineering Contradiction:
Improvemechanical retentionVSAvoidtransceiver size
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The invention merges the mechanical retention function with the existing socket connection to the host circuit board. The socket that provides electrical connection also provides mechanical retention and alignment, eliminating the need for separate mechanical retention hardware. This integration reduces the transceiver size and hardware requirements while maintaining adequate mechanical strength.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The socket connection is designed to serve multiple functions simultaneously: electrical signal transmission, mechanical retention, and alignment. This multi-functionality eliminates the need for dedicated mechanical retention hardware, reducing overall transceiver size and component count while maintaining structural integrity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Reliability

If lengthy copper connections are used to transmit electrical signals, then connectivity is achieved, but power consumption increases and bit error rate increases

Engineering Contradiction:
Improvesignal transmissionVSAvoidpower consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The invention segments the signal transmission path into two distinct segments: electrical signal transmission from IC die to IC circuit board, and optical signal transmission from IC circuit board to transceiver. This segmentation eliminates lengthy copper connections for high-speed data signals, reducing power consumption and bit error rate associated with long-distance electrical signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention replaces the mechanical/electrical signal transmission system with an optical signal transmission system for the connection between IC circuit board and transceiver. Optical signals experience less attenuation and interference over distance compared to electrical signals, reducing power consumption and bit error rate while maintaining reliable signal transmission.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the need for lengthy copper connections, lowers bit error rates, and decreases packaging costs by allowing for miniaturization and separate testing of the transceiver and IC package, while enabling easier manufacturing and reduced exposure to contamination of optical connections.

Implementation Method 1

The transceiver includes an optical engine that provides optical-to-electrical and electrical-to-optical conversion

Methodology Applied
Scientific EffectOptical-to-electrical conversion: Photoelectric Effect

Implementation Method 2

the electrical signals received from the IC package 504 are converted to optical signals that are transmitted through the optical fiber cable 500a

Methodology Applied
Scientific EffectElectrical-to-optical conversion: Light Emitting Diode

Data Source

PatentUS12140809B2Transceiver and interface for IC package
Publication Date: 2024.11.12 SAMTEC INC
  • US12140809B2 patent drawing
  • US12140809B2 patent drawing
  • US12140809B2 patent drawing

AI summary

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.