PMR Transducer Shield Notch Control via Segmented Planarization
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Solution Overview
Problem
Conventional methods for fabricating PMR transducers result in variations in structure height and notch direction due to inconsistent removal of intermediate layers, leading to performance variability.
Innovation Solution
A method involving two planarization stop layers with different characteristics and pressures, along with specific materials like Ru, Ta, Ti, DLC, and SiC, is used to control the removal of intermediate layers, ensuring a flat surface and precise notch formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional CMP method is used to remove intermediate layers, then the process is simple and fast, but the removal is inconsistent leading to variations in structure height and notch direction
Solution Approach 1:
The planarization process is divided into multiple sequential CMP steps, each removing a specific intermediate layer or portion thereof. The first CMP step removes the first intermediate layer, the second CMP step removes the second intermediate layer, and the third CMP step removes any remaining portions. This segmentation allows precise control over the removal of each layer while maintaining process simplicity.
2Manufacturing precision
If single planarization step is used, then the process is simple, but the surface flatness and notch formation control are insufficient
Solution Approach 1:
The planarization is segmented into three distinct CMP steps with different objectives: the first step planarizes the surface and removes the first intermediate layer, the second step removes the second intermediate layer to form the notch, and the third step removes any remaining portions. This segmentation achieves superior surface flatness and notch control while the sequential nature allows each step to be optimized independently.
Solution Approach 2:
The first CMP step performs preliminary planarization of the surface before subsequent processing steps. By establishing a flat surface early in the process, subsequent steps can proceed with better control and precision, reducing the need for additional corrective operations and optimizing overall process time.
3Manufacturing precision
If conventional single stop layer is used, then the structure is simple, but the control over intermediate layer removal is insufficient
Solution Approach 1:
The stop layer structure is segmented into multiple distinct layers: a first stop layer that terminates the first CMP step and a second stop layer that terminates the second CMP step. Each stop layer has different material composition and thickness characteristics, allowing independent control over the removal of different intermediate layers. This layered stop structure provides precise control over intermediate layer removal while maintaining relatively simple fabrication procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves control over the intermediate layer removal and shield notch formation, resulting in more consistent and improved performance of the PMR transducer.
Implementation Method 1
A first planarization is performed on at least the intermediate layer. At least a portion of the second planarization stop layer is removed during the first planarization.
Implementation Method 2
A second planarization is performed. At least a portion of the first planarization stop layer remains after the second planarization is performed.
Data Source
AI summary
A perpendicular magnetic recording (PMR) transducer is provided. The PRM transducer includes a PMR pole having a top, a bottom, and at least one sidewall, the bottom having a bottom width, the top having a top width bigger than the bottom width. The PRM transducer further includes an intermediate layer adjacent to the at least one sidewall, a write gap on the PMR pole, the write gap including a first layer on the PMR pole, the first layer including a planarization stop layer, and a shield on the write gap.