PMUT Micromechanical Component With Flip-Chip ASIC Interconnect
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Solution Overview
Problem
Existing ultrasonic transducer devices face challenges in efficiently connecting piezoelectric elements to control circuits due to the need for bonding wires, which complicate production, increase device size, and limit the flexibility of production processes, especially for large arrays.
Innovation Solution
Implementing flip chip technology to connect piezoelectric elements directly to control circuits using electrical contact connections, eliminating the need for bonding wires and allowing for a vertical, stacked arrangement that simplifies production and reduces device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire bonding is used to connect MEMS chip and ASIC chip, then electrical connections can be established, but the device complexity increases and scalability is limited
Solution Approach 1:
The patent combines the MEMS chip and ASIC chip into a single integrated device structure, eliminating the need for separate wire bonding connections. The control circuit is directly integrated on the same chip as the PMUT array, merging previously separate components into one unified device that reduces wiring complexity while maintaining electrical connection reliability.
Solution Approach 2:
The patent transitions from a planar wire bonding approach to a three-dimensional vertical integration architecture. Electrical connections are established through vertical vias and stacked layers rather than lateral wire bonds, changing the dimensional approach to interconnection and reducing the complexity of wiring arrangements.
2Measurement precision
If the number of PMUTs is increased to form large arrays, then the imaging resolution improves, but the edge length for wire bonding does not scale proportionally
Solution Approach 1:
By integrating the control circuit directly on the MEMS chip, the patent eliminates the need for extensive wire bonding infrastructure that would be required to support large-scale PMUT arrays. This merging of functions allows high-resolution imaging with thousands of elements without proportionally increasing manufacturing complexity.
3Reliability
If ASIC chip and MEMS chip are arranged in parallel, then electrical connections can be made, but the ultrasonic head size increases
Solution Approach 1:
The patent merges the ASIC chip and MEMS chip into a single integrated chip structure, eliminating the need for parallel arrangement of separate chips. This integration dramatically reduces the overall area of the ultrasonic head while maintaining all necessary electrical connections through on-chip interconnects.
4Ease of operation
If bonding wires are used for electrical connections, then the PMUTs can be controlled, but the structure becomes complex and gel application becomes difficult
Solution Approach 1:
The patent extracts and eliminates the bonding wire infrastructure from the device architecture. By integrating the control circuit directly on the chip, the complex wire bonding structure is removed entirely, simplifying both the device structure and the gel application process while maintaining full PMUT control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables simple, cost-effective production of ultrasonic transducer devices with a smaller footprint, improved protection of piezoelectric elements, and greater flexibility in producing large arrays of piezoelectric elements with high piezo coefficients.
Implementation Method 1
Such devices that emit and detect ultrasonic waves by means of the piezoelectric effect are referred to as piezoelectric micromachined ultrasonic transducers (PMUTs)
Implementation Method 2
Piezoelectric elements produce vibrations of diaphragms and surrounding liquids, whereby ultrasonic waves are emitted
Data Source
AI summary
A micromechanical component for a sound transducer device. The micromechanical component includes a substrate, a diaphragm, at least one piezoelectric element, and at least one electrical contact connection. The diaphragm can vibrate and is connected to the substrate. The at least one piezoelectric element is disposed between the diaphragm and the substrate and is connected to the diaphragm. The at least one piezoelectric element is designed to produce and/or detect vibrations of the diaphragm in the ultrasonic range. The at least one electrical contact connection is electrically connected to the at least one piezoelectric element. The micromechanical component can be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit by means of the at least one electrical contact connection.