Pneumatic Push-Up Unit for Die Separation from Dicing Tape

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Solution Overview

Problem

Conventional die bonding processes using solid push-up units can cause damage to semiconductor dies due to constrained forces, especially when thin dies are handled in high-density lamination packages, leading to issues like dropout and breaking.

Innovation Solution

A die bonding apparatus and method utilizing a push-up unit with an elastic body and a vacuum system, where the push-up portion is housed within a cylinder that applies pressure through air supply, allowing for controlled separation of dies from dicing tape with reduced mechanical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a solid push-up unit is used to separate the die from the dicing tape, then the die can be pushed up effectively, but the die may be damaged due to constrained forces

Engineering Contradiction:
Improvedie separation efficiencyVSAvoiddie integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent replaces the solid push-up unit with a pneumatic push-up unit that uses compressed gas to inflate an elastic body (such as a balloon or rubber membrane). This pneumatic system allows the die to be pushed up from below through uniform expansion of the elastic body, eliminating the concentrated constrained forces that caused damage with solid push-up units while maintaining effective separation capability

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent changes the physical state and pressure parameters of the push-up mechanism. By controlling the inflation pressure of the elastic body, the system can adjust the pushing force dynamically. The elastic body expands gradually under controlled pressure, providing a soft, uniform pushing action that prevents die damage while ensuring complete separation from the dicing tape

Inventive Principle:
Principle #35Parameter changes

2Length of moving object

If thin dies are used for high-density lamination packages, then the package thickness is reduced, but the dies become more susceptible to damage during handling

Engineering Contradiction:
Improvedie thicknessVSAvoiddie mechanical strength
Core Design Contradiction:
Length of moving objectVSStrength

Solution Approach 1:

The pneumatic push-up unit provides uniform, distributed pressure through the inflated elastic body, which gently lifts thin dies without creating stress concentration points. This pneumatic lifting mechanism handles thin dies (10 μm or less) with forces distributed across the entire die surface, preventing breakage that would occur with localized contact from solid push-up units

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The elastic body itself acts as a flexible element that conforms to the die surface and distributes the pushing force uniformly. This flexible membrane approach replaces rigid solid structures with compliant materials that adapt to the thin die geometry, providing support and preventing mechanical failure during the separation process

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution minimizes die damage and ensures reliable bonding by distributing pressure uniformly, reducing production costs and enabling precise control over the die picking and bonding process.

Implementation Method 1

a suction opening portion, which is configured to suck said dicing tape with vacuum

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

a push-up portion, which is made of an elastic body sealing a fluid or a power therein, and is configured to push up said dicing tape

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

a cylinder, which is configured to apply pressure to said push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder

Methodology Applied
Scientific EffectPressure Increase: Pressure Increase

Data Source

PatentUS9245778B2Die bonding apparatus, die picking up apparatus and die picking up method
Publication Date: 2016.01.26 FASFORD TECH
  • US9245778B2 patent drawing
  • US9245778B2 patent drawing
  • US9245778B2 patent drawing

AI summary

A die bonding apparatus includes a work supply/transfer portion for transferring a substrate; a bonding portion for conducting bonding of a die on the substrate; a wafer supply portion for supplying a wafer having the die thereon; and a controller portion for controlling equipment, wherein the wafer supply portion has a push-up unit for pushing up a dicing tape from a lower part, for separating the die from the dicing tape, and the push-up unit has a suction opening portion, which is configured to suck the dicing tape with vacuum, a push-up portion, which is made of an elastic body, sealing a fluid or a power therein, and is configured to push up the dicing tape, a cylinder, which is configured to apply pressure to the push-up portion, and an air supply means for supplying an air for changing the pressure within the cylinder through control of the controller portion.