Pod Pressure Control for Particle Prevention in Substrate Processing

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Solution Overview

Problem

Conventional substrate processing apparatuses fail to prevent particles from adhering to wafers during the opening and closing of pod lids, leading to contamination and quality issues.

Innovation Solution

A substrate processing apparatus is designed with a gas introduction mechanism that maintains a higher inner pressure within the pod than the lid opening/closing space, using a controller to manage the pressure and gas flow, preventing particles from entering the pod during lid operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the lid of the pod is opened or closed to transfer substrates, then substrate transfer between chambers is enabled, but particles are generated and may adhere to wafers causing contamination

Engineering Contradiction:
Improvesubstrate transfer efficiencyVSAvoidparticle contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary action by pressurizing the pod interior with inert gas before the lid opening/closing operation begins. This establishes a positive pressure environment in advance that prevents particle ingress during the subsequent lid operation, addressing the contamination issue while maintaining transfer efficiency

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies inert atmosphere by introducing inert gas into the pod to create a positive pressure environment. This inert gas atmosphere prevents external particles from entering the pod during lid operations while also protecting the substrate from oxidation and other chemical reactions, thus resolving the contamination problem without affecting substrate transfer

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Reliability

If inert gas is supplied into the pod to replace the inner atmosphere, then adhesion of natural oxide and gas adhesion are prevented, but particles from pod opening/closing mechanism still adhere to wafers

Engineering Contradiction:
Improvesubstrate qualityVSAvoidparticle adhesion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies pneumatic principles by using gas pressure differential to control particle movement. By maintaining positive pressure inside the pod through inert gas supply, the system creates a pressure barrier that prevents particles from the opening/closing mechanism from entering the pod, while also achieving atmosphere replacement to prevent oxide adhesion and gas adhesion

Inventive Principle:
Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively prevents particle adherence to wafers by maintaining a positive pressure within the pod, ensuring cleaner and more reliable substrate processing.

Implementation Method 1

a monitor part configured to monitor and adjust an inner pressure of the substrate container by controlling the gas introduction mechanism; and a controller configured to: (i) control the lid opening/closing mechanism to attach or detach the lid; and (ii) control the monitor part to maintain the inner pressure of the substrate container higher than an inner pressure of the lid opening/closing space while the lid opening/closing mechanism detaches the lid

Methodology Applied
Scientific EffectPressure gradient: Pressure Gradient

Data Source

PatentUS10928798B2Substrate processing apparatus
Publication Date: 2021.02.23 KOKUSAI DENKI KK
  • US10928798B2 patent drawing
  • US10928798B2 patent drawing
  • US10928798B2 patent drawing

AI summary

A technique is capable of preventing particles from adhering onto a wafer when a lid is attached or detached from a pod. A substrate processing apparatus includes: a placement part whereon a substrate container is placed; a guide part constituting a lid opening/closing space; a gate part separating the lid opening/closing space from a transfer chamber; a lid opening/closing mechanism provided in the lid opening/closing space and configured to attach or detach a lid of the substrate container; a gas introduction mechanism configured to supply a gas into the substrate container; a monitor part configured to monitor and adjust an inner pressure of the substrate container; and a controller configured to: (i) control the lid opening/closing mechanism; and (ii) control the monitor part to maintain the inner pressure of the substrate container higher than an inner pressure of the lid opening/closing space while the lid opening/closing mechanism detaches the lid.