Pogo Pin Coolant Circulation for Hot Chip Testing Contacts
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Solution Overview
Problem
The increased complexity and power consumption of modern chips during testing leads to excessive heat generation, causing solder balls to melt and stick to pogo pins, resulting in test failures and potential damage to the chip or testing apparatus.
Innovation Solution
A pogo pin cooling system utilizing a coolant circulation module with channels, a pump, radiator, and filter to circulate coolant through pogo pins and solder ball contacts, along with a gas supply module to purge residual coolant, maintaining a clean and dry testing environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of pogo pins is increased to accommodate more contacts on the chip, then the testing capability is improved, but the heat generation increases and solder balls are more prone to melting
Solution Approach 1:
The patent divides the cooling function into multiple segments by providing a plurality of coolant supply channels (21) and coolant recovery channels (22) that correspond to different regions of the chip slot (S). Each channel independently supplies coolant to specific pogo pins and solder ball contacts, enabling localized cooling control for different testing scenarios
Solution Approach 2:
The patent introduces coolant (Lc) as an intermediary substance to transfer heat away from the pogo pins and solder balls. The coolant circulates through the chip slot, absorbing heat generated during testing and carrying it away through the recovery channels, thus mediating the thermal interaction between the testing components
2Adaptability or versatility
If the power applied to the chip is increased to test complex functions, then the testing comprehensiveness is improved, but the heat generation increases causing solder balls to soften and melt
Solution Approach 1:
The patent applies preliminary cooling action by supplying coolant to the chip slot before and during the power application phase. The coolant circulation is activated in advance to establish a heat dissipation pathway before high power testing begins, preventing solder ball softening and melting before they can occur
Solution Approach 2:
The patent converts the harmful heat generated by high power testing into a beneficial cooling opportunity. By actively circulating coolant through the chip slot during high power testing, the system uses the heat generation itself as the driving force for coolant circulation, transforming the harmful thermal effect into the basis for effective heat removal
3Temperature
If coolant is supplied continuously to cool pogo pins, then the temperature control is improved, but the complexity of the system increases
Solution Approach 1:
The patent merges the coolant supply and recovery functions into an integrated circulation system. The coolant supply channels (21) and recovery channels (22) are combined with a pump (23) and coolant tank (24) to form a unified cooling circuit that continuously recirculates coolant, reducing the need for separate cooling systems for each pogo pin
Solution Approach 2:
The coolant circulation system serves multiple functions simultaneously: it cools pogo pins, cools solder ball contacts, removes heat from the chip slot, and prevents solder ball melting. This multi-functional approach eliminates the need for separate cooling mechanisms for each function, reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools pogo pins and solder balls, preventing melting and contamination, ensuring reliable testing and efficient reuse of coolant, and maintaining chip integrity.
Implementation Method 1
the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet
Implementation Method 2
the pump, the coolant tank, the radiator, and the filter are provided on the coolant pipe line
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip slot and a coolant recovery channel communicated with an outlet of the chip slot. When an electronic device is accommodated in the chip slot, the coolant circulation module supplies a coolant into the chip slot through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.