POL Power Module Layout for Ultrathin High-Density Conversion
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Solution Overview
Problem
The challenge is to enhance the efficiency, reduce the height, and improve the power density of a Point-of-Load (POL) integrated power supply module for optical communication modules, which require low-voltage high-current output and efficient heat dissipation, especially as processor load currents increase and temperatures rise.
Innovation Solution
A POL integrated power supply module is designed with an inductor assembly, substrate, switch unit, and input capacitor, featuring a magnetic core, winding, and power connecting pieces, arranged in a specific structure for ultrathin thickness and efficient power delivery, with a production process that includes pressing, welding, plastic packaging, drilling, electroplating, and etching to form a conductive pattern, and a signal connecting piece for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional POL switch buck regulator is used for power supply, then power supply function is achieved, but module height is large and power density is low
Solution Approach 1:
The patent transitions from traditional planar layout to a three-dimensional stacked architecture where the inductor assembly is positioned on the back surface of the substrate while switch units and capacitors are arranged on the front surface. This vertical stacking approach reduces the horizontal footprint and enables lower profile design, directly addressing the contradiction between power density and module height.
Solution Approach 2:
The inductor assembly is integrated within a compact structure that nests multiple components together. The magnetic core with embedded windings and power connecting pieces forms a compact unit that is nested on the substrate, maximizing space utilization and reducing overall module height while maintaining high power density.
2Productivity
If processor load current is increased for higher data communication rate, then communication performance is improved, but heat dissipation problem worsens
Solution Approach 1:
The patent implements localized thermal management by positioning heat-generating switch units and power components on opposite sides of the substrate, allowing heat to dissipate in different directions. The inductor assembly on the back surface acts as a heat sink, while front surface components can be thermally managed independently, improving overall heat dissipation efficiency at high current loads.
3Device complexity
If inductor assembly is integrally formed for simplified structure, then manufacturing complexity is reduced, but manufacturing precision requirement increases
Solution Approach 1:
The patent combines the inductor winding, power connecting pieces, and magnetic core into a single integrally formed assembly through pressing. This merging of components simplifies the overall structure by eliminating the need for separate mounting and interconnection steps, while the pressing process achieves the necessary manufacturing precision for electrical connections and mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves an ultrathin thickness, simplifies the production process, and improves the reliability of the POL integrated power supply module, reducing current ripple and enhancing dynamic response capability and power supply efficiency.
Implementation Method 1
an inductor assembly, a substrate, a switch unit and an input capacitor; the substrate comprises a first surface and a second surface which are opposite to each other, the inductor assembly is arranged on the second surface of the substrate
Implementation Method 2
the power connecting piece, the winding and the magnetic material are integrally formed through pressing to form a magnetic core and the inductor assembly
Data Source
AI summary
The application discloses a POL integrated power supply module and a production process thereof. The POL integrated power supply module comprises an inductor assembly, a substrate, a switch unit and an input capacitor. The substrate comprises a first surface and a second surface which are opposite, the inductor assembly is arranged on the second surface of the substrate, and the switch unit and the input capacitor are arranged on the first surface of the substrate. According to the POL integrated power supply module, a structural layout is provided, and the ultrathin thickness of the POL integrated power supply module is achieved. According to the POL integrated power supply module with the structure, a corresponding production process is provided, the production process is simplified, and the reliability of the POL integrated power supply module is improved.