Polarized Kerf Monitoring for Thermal Cutting Quality Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cutting processes lack a reliable method to determine cutting quality and control the process effectively, particularly in thermal cutting of plate-like workpieces, leading to irregularities such as burr formation, roughness, and dimensional inaccuracies due to changes in kerf width during the cutting process.
Innovation Solution
A device and method using an image acquisition system with polarized observation beams to measure the angle and distance between luminous fringes at the cutting edges, allowing for real-time monitoring and control of the cutting process by adjusting parameters like feed rate and laser power to maintain a consistent kerf width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional thermal cutting processes are used without advanced monitoring, then the cutting process is simple to operate, but the cutting quality deteriorates due to irregularities such as burr formation, roughness, and dimensional inaccuracies
Solution Approach 1:
The patent replaces complex mechanical monitoring systems with an optical-based monitoring system that uses light reflection properties to detect cutting quality parameters. The image acquisition device captures optical signals from the interaction zone, and the evaluation device processes these signals to determine cutting quality, substituting mechanical measurement methods with optical detection.
Solution Approach 2:
The patent utilizes changes in optical parameters (reflection intensity, polarization state) of light interacting with the cutting zone to detect cutting quality. By monitoring how light reflects from the kerf walls and cutting front, the system translates optical parameter changes into quality metrics without requiring direct physical contact or complex mechanical sensors.
2Manufacturing precision
If the kerf width varies during the cutting process, then the cutting process is faster and more productive, but the manufacturing precision deteriorates due to dimensional inaccuracies and burr formation
Solution Approach 1:
The patent implements a feedback mechanism where the evaluation device continuously monitors the kerf width and cutting quality parameters in real-time during the cutting process. The system provides feedback signals that can be used to adjust cutting parameters (such as feed rate, laser power) to maintain consistent kerf width, thereby ensuring manufacturing precision while allowing for optimized cutting speeds.
3Measurement precision
If advanced image acquisition and evaluation systems are implemented, then the measurement precision of cutting parameters improves, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement systems with optical-based image acquisition and evaluation systems. By using light reflection properties and image processing algorithms, the system achieves high measurement precision for cutting parameters without requiring direct mechanical contact or complex sensor arrays.
Solution Approach 2:
The patent creates optical copies (images) of the cutting zone and kerf structure through light reflection. The image acquisition device captures visual information from the interaction zone, and the evaluation device processes these optical copies to extract precise measurement data about cutting parameters, avoiding the need for direct physical measurement instruments.
4Manufacturing precision
If the observation direction is not aligned with the feed direction, then the evaluation device can determine burr formation, roughness, and groove formation, but the measurement of kerf width consistency becomes more difficult
Solution Approach 1:
The patent utilizes changes in optical parameters (reflection intensity, polarization state) of light interacting with the cutting zone to detect cutting quality. By monitoring how light reflects from the kerf walls and cutting front, the system translates optical parameter changes into quality metrics without requiring direct physical contact or complex mechanical sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures high-quality cuts by preventing irregularities in the cutting process, maintaining a constant kerf width, and providing a robust feed reserve, thereby enhancing cut quality and preventing incomplete cuts.
Implementation Method 1
The image acquisition device has a polarizer which transmits a first linear polarization component of an observation beam to a detector for observing the area to be monitored and which filters a second polarization component of the observation beam that is perpendicular to the first
Implementation Method 2
The image of the workpiece area to be monitored, typically captured from the top of the workpiece, is usually a thermal image
Data Source
Figure 1a~1b
Figure 2a~4
AI summary
The invention relates to a device (1) for monitoring, in particular for controlling a thermal cutting process on a workpiece (3), comprising: a focusing apparatus (4) for focusing a processing beam, in particular a laser beam (2), on the workpiece (2) in order to form a cutting kerf (16) on the workpiece (3), an image detection apparatus (9) for producing at least one image of a region of the workpiece (3) to be monitored, and an evaluation apparatus (19), which is designed to determine, based on the at least one image, at least one measured value for the course of the gap width of the cutting kerf (16) in the thickness direction (Z) of the workpiece (3), in particular for an angle between the two cutting flanks of the cutting kerf (16). The invention further relates to an associated method for monitoring, in particular for controlling, a thermal cutting process on a workpiece (3).