Polished Y2O3 Upper Electrode for Plasma Processing
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Solution Overview
Problem
The existing plasma processing devices require a lengthy seasoning process after manufacturing or replacement of components, particularly the upper electrode, which prolongs the time needed to achieve a stable etching speed.
Innovation Solution
A plasma processing device with a polished Y2O3 covering layer on the upper electrode, reducing the surface area in contact with radicals and thereby minimizing radical consumption, allowing for a faster attainment of required etching speed without extensive seasoning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a covering layer is formed on the upper electrode through thermal-spraying, then plasma resistance is improved, but etching speed is reduced due to increased radical consumption
Solution Approach 1:
The covering layer surface is polished before plasma etching begins, removing the rough surface structure that causes excessive radical adsorption. This preliminary surface treatment prevents the harmful effect of radical consumption on etching speed while maintaining the plasma resistance function of the covering layer.
Solution Approach 2:
The surface roughness parameter of the covering layer is changed from a rough state (after thermal-spraying) to a smooth state (after polishing). This parameter change reduces the surface area available for radical adsorption, thereby minimizing radical consumption and improving etching speed while preserving the covering layer's plasma resistance properties.
2Stability of the object's composition
If seasoning is performed to stabilize etching speed, then etching speed stability is improved, but time required is increased
Solution Approach 1:
The covering layer surface is polished in advance before plasma etching starts, pre-establishing the optimal surface condition that minimizes radical consumption. This preliminary action eliminates the need for extended seasoning time to achieve stable etching speed, as the stable condition is achieved immediately through surface polishing.
Solution Approach 2:
The polishing process skips the lengthy seasoning period traditionally required to stabilize etching speed. By directly creating the optimal surface condition through polishing, the method rushes through the time-consuming seasoning phase while achieving the same stability outcome immediately.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polished Y2O3 covering layer on the upper electrode enables an etching speed close to the required speed immediately after manufacturing, significantly shortening the seasoning time and maintaining efficiency.
Implementation Method 1
formed with a covering layer having plasma resistance
Implementation Method 2
A surface of the covering layer is polished
Data Source
AI summary
A method of manufacturing an upper electrode of a plasma processing device includes forming a covering layer having plasma resistance on a surface of a main body portion constituting the upper electrode at a side of the processing space; polishing a surface of the covering layer exposed to the processing space; and after the polishing, blasting the surface of the covering layer polished at the polishing.