Polishing Apparatus Activated Gas Bubbles High Hardness Materials

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Solution Overview

Problem

Existing methods struggle to efficiently polish high hardness materials like SiC and diamond due to their hardness and fragility, leading to inefficient polishing rates and increased defects.

Innovation Solution

A polishing method and apparatus that incorporates activated gas turned into bubbles through gas discharge, mixed with abrasive particles in a slurry, combining mechanical and chemical polishing to enhance the polishing efficiency of high hardness materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical polishing is used on high hardness materials, then the polishing process can be performed, but the polishing rate is low and processing resistance is high

Engineering Contradiction:

Improvepolishing rateVSAvoidprocessing resistance

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the chemical composition and physical state parameters of the polishing slurry by incorporating activated gas and micro-nano bubbles, transforming it from a conventional mechanical polishing medium to a chemically active slurry that can efficiently process high hardness materials

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite polishing system combining mechanical abrasive particles with chemically active gas components (activated gas and micro-nano bubbles) in the slurry, enabling simultaneous mechanical and chemical polishing actions on high hardness materials

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If conventional polishing methods are used on high hardness materials, then the material can be polished, but polishing defects increase

Engineering Contradiction:

Improvepolishing qualityVSAvoidpolishing rate

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent modifies the slurry parameters by adding activated gas and micro-nano bubbles, which chemically soften the material surface and reduce polishing defects while maintaining high polishing rates

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The activated gas and micro-nano bubbles act as intermediaries between the abrasive particles and the workpiece surface, facilitating chemical reactions that reduce material hardness locally and enable defect-free polishing

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method achieves high efficiency in polishing high hardness materials by integrating mechanical and chemical polishing actions, significantly improving the polishing rate and reducing defects in materials such as SiC and diamond.

Implementation Method 1

an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry

Methodology Applied

Scientific EffectGas discharge: Plasma

Data Source

PatentUS10471565B2Polishing apparatus for a work with mechanical polishing function and chemical polishing function

Publication Date: 2019.11.12 FUJIKOSHI MACHINERY

AI summary

The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.