Polishing Carrier Surface Measurement via Sensor Pivoting
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Solution Overview
Problem
Conventional polishing machines lack real-time monitoring mechanisms for carrier wear, leading to inefficient and costly replacements due to reliance on experience-based evaluations.
Innovation Solution
A system with a sensor carrier and control module that extracts surface information of the carrier using a rotating platform and pivoting sensor, constructing a surface topography and determining the carrier's service life, enabling real-time monitoring and optimized replacement timing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If experience-based evaluation is used to determine carrier replacement, then operational simplicity is maintained, but measurement precision and reliability of carrier status assessment deteriorates
Solution Approach 1:
The patent replaces the mechanical/experience-based evaluation system with an optical sensing system. A sensor (optical device) is used to detect surface characteristics of the carrier, and a processing unit analyzes the detected information to determine carrier status. This substitution transforms subjective experience-based judgment into objective, precise measurement while maintaining ease of operation through automated analysis.
2Measurement precision
If real-time monitoring system is implemented, then measurement precision and reliability improve, but device complexity increases
Solution Approach 1:
The sensor carrier is designed to serve multiple functions: it holds the sensor, provides a reference surface for measurement, and can be integrated into the existing polishing machine structure. The processing unit not only analyzes carrier status but can also control the polishing process parameters. This multi-functionality reduces the need for separate dedicated components, thereby limiting the increase in device complexity.
Solution Approach 2:
The system uses the carrier's own surface characteristics as the measurement target, eliminating the need for separate calibration standards or reference objects. The sensor carrier integrates the sensing function directly into the polishing process setup, allowing the system to monitor itself without external intervention or additional complex infrastructure.
3Loss of time
If carrier replacement is delayed based on experience evaluation, then loss of time for replacement operations is reduced, but manufacturing precision deteriorates due to poor polishing quality
Solution Approach 1:
The system implements continuous feedback monitoring of carrier surface characteristics during the polishing process. The sensor detects changes in carrier surface topology, and the processing unit analyzes this information to determine when the carrier has degraded to a point where it affects polishing quality. This feedback mechanism enables precise timing of carrier replacement, avoiding both premature replacement (wasting time) and delayed replacement (compromising quality).
Solution Approach 2:
The system performs preliminary detection and analysis of carrier wear trends before the carrier actually degrades to a state that affects polishing quality. By monitoring surface characteristics continuously, the system can predict carrier failure and schedule replacement at the optimal moment, preventing quality deterioration while minimizing downtime. The carrier replacement is triggered by objective measurements rather than waiting for visible signs of wear.
Data Source
AI summary
A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.


