Polishing Composition Adsorbed Polymer Defect Removal
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Solution Overview
Problem
The increasing complexity of semiconductor devices has led to a higher incidence of nanoscale fine surface defects on substrates due to foreign matter, which existing polishing compositions fail to effectively address, particularly in terms of hydrophilicity and defect removal efficiency.
Innovation Solution
A polishing composition containing silicon dioxide, a water-soluble polymer with a weight average molecular weight of 300,000 or less, and water, where the polymer is adsorbed on silicon dioxide in a concentration of 4 ppm or more by mass and 15% or more relative to the total carbon concentration, enhancing hydrophilicity and defect removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a water-soluble polymer is used to impart hydrophilicity to the substrate surface, then the removal efficiency of foreign matter is improved, but the molecular weight control and adsorption concentration precision become more difficult to achieve
Solution Approach 1:
The patent specifies precise parameter ranges: weight average molecular weight of 300,000 or less, adsorbate concentration of 4 ppm by mass or more in terms of carbon, and adsorbate percentage of 15% or more relative to total carbon concentration. By controlling these parameters within defined ranges, the patent achieves both high removal efficiency and precise manufacturing control.
Solution Approach 2:
The patent uses silicon dioxide particles as a carrier or template to which the water-soluble polymer adsorbs. This carrier system allows precise control of the polymer distribution and concentration on the substrate surface, enabling both high removal efficiency and manufacturing precision.
2Ease of operation
If the water-soluble polymer has lower molecular weight to improve ease of handling, then the adsorption performance and hydrophilicity enhancement are improved, but the mechanical stability of the polishing composition may be reduced
Solution Approach 1:
The patent sets the weight average molecular weight at 300,000 or less, which is sufficiently low to ensure ease of handling and adsorption performance, yet maintains mechanical stability through the synergistic interaction with silicon dioxide particles and the basic compound system.
Solution Approach 2:
The polishing composition is formulated as a composite system containing silicon dioxide particles, water-soluble polymer, and basic compound. This composite structure provides mechanical stability through the particle network while the polymer ensures ease of handling and adsorption performance.
3Reliability
If the adsorbate concentration is increased to enhance hydrophilicity, then the removal efficiency of foreign matter is improved, but the cost and complexity of the polishing composition increase
Solution Approach 1:
Silicon dioxide particles serve as an intermediary carrier that facilitates the adsorption of water-soluble polymer onto the substrate surface. This intermediary system enables effective hydrophilicity enhancement at controlled concentrations, avoiding the need for excessive polymer amounts that would increase complexity and cost.
Solution Approach 2:
The patent optimizes the adsorbate concentration at 4 ppm by mass or more in terms of carbon, which is sufficiently high to achieve effective hydrophilicity enhancement while remaining within economically viable and compositionally simple parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition significantly reduces fine surface defects by improving hydrophilicity and cleanliness of the substrate surface, allowing for efficient removal of foreign matter and enhancing polishing efficiency while maintaining dispersion stability.
Implementation Method 1
an adsorbate containing at least part of the water-soluble polymer is adsorbed on the silicon dioxide
Implementation Method 2
impart hydrophilicity to a substrate surface after polishing, thereby enhancing removal efficiency of foreign matter
Data Source
AI summary
A polishing composition contains silicon dioxide, a water-soluble polymer, and water. An adsorbate containing at least part of the water-soluble polymer is adsorbed on the silicon dioxide. The adsorbate is contained in a concentration of 4 ppm by mass or more in terms of carbon. A percentage of the concentration of the adsorbate in terms of carbon relative to a total carbon concentration in the polishing composition is 15% or more.