Polishing Composition with Block Polyether for Haze and Foaming Control
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Solution Overview
Problem
Existing silicon wafer polishing compositions face issues with foaming, which leads to improper operation of liquid level sensors and contamination during the polishing process, while also struggling to effectively suppress haze and improve polishing performance.
Innovation Solution
A polishing composition comprising a pH regulator, a water-soluble polymer compound, and a compound with an alkylene diamine structure having a block type polyether bonded to its nitrogens, specifically optimized to suppress foaming and enhance surface properties by adjusting the carbon number and mass ratio of the oxyethylene and oxypropylene groups in the block type polyether.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If block type polyether and hydroxyethyl cellulose or polyvinyl alcohol are used to adjust surface tension and suppress haze, then haze suppression effect is improved, but bubble formability is accelerated
Solution Approach 1:
The patent changes the chemical structure parameters of the polyether by specifying the ratio of oxyethylene units to oxypropylene units (within 5:95 to 45:55), and controls the molecular weight range (1,000 to 100,000), to achieve optimal balance between haze suppression and bubble suppression
Solution Approach 2:
The patent uses a composite polishing slurry containing both the block type polyether and colloidal silica particles, where the polyether provides surface tension adjustment and haze suppression while the specific composition ratio prevents excessive bubble formation
2Object-affected harmful factors
If processing pressure is decreased to suppress haze in finish polishing, then haze suppression is improved, but polishing rate is reduced
Solution Approach 1:
The patent changes the chemical composition parameters of the polishing slurry by specifying the polyether content (0.1 to 10 wt%) and the ratio of oxyethylene to oxypropylene units, enabling effective haze suppression at reduced processing pressures while maintaining adequate polishing rate through optimized chemical composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces foaming, improves surface properties such as LPD and haze, and prevents metal contamination by forming a protective film on the polishing surface, thereby enhancing the overall polishing performance.
Implementation Method 1
The block type polyethers described in JP-A 10-245545, JP-A 2001-110760 and JP-A 2005-85858, and the hydroxyethyl cellulose and polyvinyl alcohol described in JP-A 2005-85858 have properties to adjust surface tension
Implementation Method 2
a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure
Data Source
AI summary
A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group:where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more.