Polishing Composition with Block Polyether for Silicon Wafer Defoaming
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Solution Overview
Problem
Existing polishing compositions for silicon wafers do not adequately enhance polishing speed and reduce surface roughness, and those with defoaming properties can generate foam that degrades polishing performance in secondary polishing steps.
Innovation Solution
A polishing composition incorporating an alkylamine structure with bonded block polyether containing oxyethylene and oxypropylene groups, a basic compound, and abrasives, which improves polishing speed and surface roughness while providing defoaming properties by stabilizing the dispersion of polishing aid and preventing foam formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a polishing composition includes only basic compounds and surfactants to improve polishing speed and surface roughness, then polishing performance is improved to some extent, but foam is generated during dilution or stirring that sticks to equipment surfaces and generates aggregates, degrading LPD and preventing sufficient polishing performance in secondary polishing
Solution Approach 1:
The patent introduces a water-soluble polymer compound as an intermediary substance that mediates between the basic compound/surfactant system and the polishing process. This polymer acts as a foam suppressant and dispersion stabilizer, preventing foam generation while maintaining the polishing performance enhancement from basic compounds and surfactants. The polymer compound serves as a mediator that resolves the conflict between achieving low surface roughness and preventing harmful foam formation.
Solution Approach 2:
The patent creates a composite polishing composition by combining multiple functional components: basic compounds (for polishing speed), surfactants (for surface roughness), and water-soluble polymer compounds (for foam suppression and dispersion stability). This composite formulation integrates the benefits of each component while mitigating their individual drawbacks, particularly the foam generation issue that plagues simpler formulations.
2Productivity
If polishing compositions are optimized for high polishing speed in secondary polishing, then polishing speed improves, but the composition lacks sufficient defoaming properties causing foam-related defects
Solution Approach 1:
The patent modifies the chemical parameters of the polishing composition by incorporating water-soluble polymer compounds with specific molecular characteristics. This parameter change transforms the composition's foam suppression capability while maintaining high polishing speed. The polymer's solubility, molecular weight, and structural parameters are optimized to simultaneously achieve fast polishing and reliable foam control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively increases polishing speed, reduces surface roughness, and improves defoaming properties, leading to enhanced polishing characteristics and reduced light point defects and haze levels.
Implementation Method 1
at least one block polyether (that includes an oxyethylene group and an oxypropylene group) bonded to the two nitrogen atoms in the alkylamine structure
Implementation Method 2
providing defoaming properties by stabilizing the dispersion of polishing aid and preventing foam formation
Implementation Method 3
abrasives
Data Source
AI summary
A polishing composition that allows polishing speed to be increased and surface roughness to be reduced is provided. The polishing composition according to the present invention includes a compound including at least an oxyethylene group or an oxypropylene group in a block polyether represented by the following general formula (1), a basic compound, and abrasives: >N—R—N< (1) where R represents an alkylene group expressed as CnH2n and “n” is an integer not less than 1.