Polishing Composition Surfactant Reduces Wastewater BOD COD
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Solution Overview
Problem
Conventional polishing compositions for synthetic resins, such as those containing alumina and poly(oxyethylene-oxypropylene)glyceryl ether, have high biological oxygen demand (BOD) and chemical oxygen demand (COD), requiring significant time and labor for wastewater treatment, and often result in polishing waste and pad waste adhering to abrasive grains and the object, reducing polishing efficiency.
Innovation Solution
A polishing composition comprising 0.005-10% by mass of a polyurethane surfactant represented by general formula (1) and 3-30% by mass of abrasive grains with an average grain size of 0.015-12µm, which suppresses polishing waste and pad waste adhesion, improving removal rates while maintaining low BOD and COD, and includes a compound obtained by reacting polyalkylene oxide with methane hydrocarbon, glycerin, or methyl acetate to enhance viscosity and dispersibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional polishing compositions containing poly(oxyethylene-oxypropylene)glyceryl ether are used, then polishing performance is achieved, but BOD and COD increase requiring significant wastewater treatment time and labor
Solution Approach 1:
The patent changes the chemical composition parameters by replacing poly(oxyethylene-oxypropylene)glyceryl ether with polyether polyol having a specific molecular weight range (2000-50000) and specific structure (formula 1). This parameter change maintains polishing performance while reducing BOD and COD, thereby reducing wastewater treatment time and labor requirements.
2Productivity
If conventional polishing compositions are used, then polishing action is achieved, but polishing waste and pad waste adhere to abrasive grains and the object reducing polishing efficiency
Solution Approach 1:
The patent introduces polyether polyol as an intermediary substance that prevents adhesion between polishing waste/pad waste and abrasive grains or the object surface. This intermediary substance acts as a release agent, allowing waste to be easily removed and maintaining polishing efficiency throughout the process.
3Object-generated harmful factors
If polyether polyol with specific molecular weight and structure is used, then waste adhesion is suppressed and BOD/COD are reduced, but composition formulation complexity increases
Solution Approach 1:
The patent simplifies the formulation approach by focusing on key parameters: molecular weight (2000-50000), structure (formula 1 with specific polyether polyol residue), and content (0.005-10% by mass). By controlling these parameters, the patent achieves waste adhesion suppression and low BOD/COD without requiring complex multi-component formulations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a high removal rate for synthetic resin polishing with reduced BOD and COD, preventing waste adhesion and facilitating easier wastewater treatment, while maintaining surface quality and economic efficiency.
Implementation Method 1
a compound having an average molecular weight of 2,000-50,000 represented by the following general formula (1) (compound A), at least one compound selected from the group consisting of a compound obtained by reacting a polyalkylene oxide with a methane hydrocarbon, glycerin, 1,2,3-trimethoxypropane, diethyl ether, or methyl acetate, and polyalkylene oxide (compound B)
Implementation Method 2
3-30% by mass of abrasive grains having an average grain size of 0.015-12μm
Data Source
AI summary
A polishing composition contains a compound represented by the general formula (1) below and abrasive grains. In the general formula (1), X represents a residue of polyether polyol (having a polyether chain containing an oxyethylene group in an amount of 20 to 90% by mass) derived from a compound having an active hydrogen atom and an alkylene oxide; m represents an integer of 2 to 8, which is equal to the number of hydroxy groups contained in a single polyether polyol molecule; Y and Z represent a lower alcohol residue to which ethylene oxide or propylene oxide is added by addition polymerization, an alkyl group or an alkylene group, respectively; and n is an integer of 3 or more.