Polishing Solution Supply Device with Rotating Contact Member
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Solution Overview
Problem
The existing polishing apparatuses face issues with the splashing and adherence of polishing solution and residue onto the polishing solution supply device, leading to potential damage on the substrate and uneven polishing performance due to friction torque, while also requiring reduction in polishing solution usage to lower costs.
Innovation Solution
A polishing apparatus with a contact member that dams and controls the discharge of used polishing solution based on its angle with respect to the polishing pad, utilizing a rotating mechanism and controller to manage the flow and position of the polishing solution supply device, ensuring stable and uniform contact with the pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a polishing solution supply device is placed on the polishing surface to regulate and supply polishing solution, then the polishing solution can be evenly supplied to the substrate, but the polishing solution and residue splash and adhere to the supply device, potentially damaging the substrate and affecting polishing quality
Solution Approach 1:
The patent extracts the harmful function (damming and discharging polishing solution) from the main supply device by introducing a separate contact member. This contact member is specifically designed to interact with the polishing pad to dam and discharge polishing solution, separating this function from the main supply device body. This extraction prevents polishing solution and residue from adhering to the main supply device while maintaining effective polishing solution regulation.
Solution Approach 2:
The contact member serves as an intermediary element between the polishing solution supply device and the polishing pad. It mediates the interaction by providing a controlled interface for damming and discharging polishing solution, preventing direct contact between the main supply device and the polishing pad surface. This intermediary function eliminates the harmful adherence effect while preserving the necessary polishing solution regulation.
2Manufacturing precision
If the contact member dams and discharges polishing solution based on its angle, then uniform polishing performance is maintained, but the device complexity increases due to the rotating mechanism and controller
Solution Approach 1:
The patent applies dynamics by making the contact member rotatable relative to the polishing solution supply device through a rotating mechanism. This dynamic configuration allows the contact member's angle to be adjusted during operation, enabling it to adapt to different polishing conditions and maintain uniform polishing performance. The dynamic adjustment capability resolves the contradiction by providing precision control while accepting the necessary increase in device complexity.
Solution Approach 2:
The patent changes the angular parameter of the contact member to control the damming and discharging of polishing solution. By adjusting the angle of the contact member relative to the polishing pad, the system optimizes polishing solution flow and maintains uniform polishing performance. This parameter change approach allows precise control of polishing quality while the complexity is managed through automated control mechanisms.
3Manufacturing precision
If polishing solution is supplied onto the polishing pad to achieve planarization, then the substrate surface becomes flat and specular, but the used polishing solution requires treatment and increases operating cost
Solution Approach 1:
The patent implements discarding and recovering by using the contact member to dam and discharge used polishing solution from the polishing pad surface. The discharged polishing solution can be collected and treated separately, reducing the amount of polishing solution that mixes with contaminants and requires complete disposal. This approach recovers usable polishing solution, reducing overall consumption and operating costs while maintaining the necessary polishing function for achieving flat specular surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents polishing solution and residue from adhering to the supply device, maintains uniform polishing performance, and reduces the overall usage of polishing solution, thereby lowering operational costs and maintaining quality.
Implementation Method 1
causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up
Data Source
AI summary
There is provided an apparatus for polishing, comprising a polishing table configured to support and rotate a polishing pad; a holder configured to hold an object and press the object against the polishing pad; a polishing solution supply device provided with a contact member and configured to supply a polishing solution to an opening in a bottom face of the contact member in a state that the contact member comes into contact with or is adjacent to the polishing pad, thereby spreading the polishing solution on the polishing pad, the polishing solution supply device causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up by the contact member and setting the contact member either in a direction of keeping the dammed up polishing solution on the polishing pad or in a direction of discharging the dammed up polishing solution, according to an angle of the polishing solution supply device with respect to a radial direction of the polishing pad; an arm linked with the polishing solution supply device; a rotating mechanism configured to rotate the polishing solution supply device with respect to the arm; and a controller configured to control the rotating mechanism to change the angle of the polishing solution supply device with respect to the radial direction of the polishing pad and thereby control a discharge amount of the polishing solution by the contact member of the polishing solution supply device.