Needle-tip polishing device with segmented contact unit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional needle-tip polishing devices face difficulties in reliably pressing the polishing surface against probe needles due to increased reaction forces resulting from higher loads required for larger wafers, leading to inadequate polishing performance.
Innovation Solution
A needle-tip polishing device with a contact unit and a supporting unit that mechanically engage with each other, allowing the contact unit to maintain contact with the probe needles and resist reaction forces, ensuring the polishing surface remains in contact with the needle tips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the load of the stage to press the wafer against the probe card is increased to handle larger wafers, then the reliability of contact between probe needles and electrode pads is improved, but the reaction force on the needle-tip polishing device increases making it difficult for the hydraulic cylinder to press the wrapping sheet against the probe needles
Solution Approach 1:
The polishing device is segmented into a supporting unit (fixed to stage) and a contact unit (movable relative to supporting unit). This segmentation allows the contact unit to be independently positioned and pressed against the probe needles without being affected by the overall stage load, thereby resolving the contradiction between maintaining reliable contact and managing reaction forces.
Solution Approach 2:
A movable contact unit acts as an intermediary between the hydraulic cylinder and the probe needles. The contact unit includes a pressing surface that directly contacts the probe needles, while being movable relative to the supporting unit. This intermediary structure allows the hydraulic cylinder to apply pressing force independently of the stage load, solving the reaction force problem while ensuring reliable polishing contact.
2Manufacturing precision
If a conventional needle-tip polishing device is used with increased stage load, then the polishing function is maintained, but the hydraulic cylinder cannot respond to the increased reaction force resulting in inadequate polishing performance
Solution Approach 1:
The contact unit is designed to be movable relative to the supporting unit, allowing dynamic adjustment of the pressing force applied to the probe needles. The movable pressing surface can be independently positioned and maintained in contact with the probe needles regardless of stage load variations, ensuring consistent polishing quality and hydraulic cylinder responsiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable pressing of the polishing surface against the probe needles, enhancing the polishing process by preventing the contact unit from being pushed back by reaction forces, thus ensuring effective polishing even with increased loads.
Implementation Method 1
the needle-tip contact unit and the supporting unit include an engagement unit configured to be mechanically engaged with each other such that the first facing surface and the second facing surface are maintained to be separated from each other when the needle-tip contact unit is moved to the contact position and receives a reaction force from the needle tips
Implementation Method 2
a needle-tip polishing surface configured to polish the needle tips is formed on a portion of the needle-tip contact unit which is contacted with the needle tips
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A prober 10 including a probe card 16 having multiple probe needles 17 includes a needle-tip polishing unit 24, and the needle-tip polishing unit 24 includes a WAPP 28 to be contacted with needle tips and a supporting member 27 configured to support the WAPP 28. On a top surface of the WAPP 28, a wrapping sheet 29 is provided, and the WAPP 28 includes multiple recesses 31 formed on a bottom surface 30 thereof and the supporting member 27 includes multiple protrusions 33 formed on a ceiling surface 32 thereof. When the WAPP 28 is moved to a retreat position, the protrusions 33 are respectively inserted and fitted into the recesses 31, and when the WAPP 28 is moved to a contact position, top portions of the protrusions 33 are respectively brought into contact with portions on the bottom surface 30 where the recesses 31 are not formed.