Polishing Head Actuator Wiring Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor device manufacturing, the miniaturization of wafers requires precise control of film thickness profiles during chemical mechanical polishing, which is complicated by the need for numerous actuators and associated wiring, leading to mechanical complexity and increased cost.
Innovation Solution
A polishing apparatus with a scrolling polishing table or linear polishing belt, featuring a polishing head with independently controllable pressing actuators, such as airbags or piezoelectric elements, and a head rotation mechanism that rotates within a predetermined angle range, eliminating the need for continuous rotation and reducing wiring complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a large number of actuators are arranged to control film thickness profile with higher accuracy, then manufacturing precision is improved, but device complexity increases due to increased number of wirings
Solution Approach 1:
The patent replaces the traditional electrical wiring system with a mechanical power transmission system. A single drive mechanism located at the center of the polishing head transmits rotational force through a power transmission mechanism (such as a belt or gear system) to multiple pressing actuators distributed across the polishing head surface. This mechanical substitution eliminates the need for numerous independent electrical connections to each actuator, thereby reducing wiring complexity while maintaining the capability to independently control multiple actuators for precise film thickness profiling
Solution Approach 2:
The polishing head is designed with a universal power transmission mechanism that serves multiple functions: it provides rotational motion to all pressing actuators simultaneously, enables independent control of each actuator through a single drive source, and maintains structural compactness. This multi-functional design allows the system to achieve precise multi-point pressure control without requiring separate wiring for each actuator, thus resolving the contradiction between manufacturing precision and device complexity
2Productivity
If the polishing head is continuously rotated to maintain uniform relative speed, then productivity is improved, but device complexity increases due to difficulty of rotating with numerous wires connected
Solution Approach 1:
The patent replaces the traditional electrical wiring system with a mechanical power transmission system. A single drive mechanism located at the center of the polishing head transmits rotational force through a power transmission mechanism (such as a belt or gear system) to multiple pressing actuators distributed across the polishing head surface. This mechanical substitution eliminates the need for numerous independent electrical connections to each actuator, thereby reducing wiring complexity while maintaining the capability to independently control multiple actuators for precise film thickness profiling
Solution Approach 2:
The patent extracts the power transmission function from the electrical wiring system and implements it through a dedicated mechanical power transmission mechanism. By separating the power transmission function from the control wiring, the system enables continuous rotation of the polishing head without the complexity of managing numerous rotating electrical connections. The power transmission mechanism is specifically designed to handle the mechanical stresses of continuous rotation while the actuators receive power mechanically rather than through rotating wires
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate control of film thickness profiles without twisting control lines, simplifying the mechanism and reducing costs, while maintaining uniform polishing velocity across the wafer surface.
Implementation Method 1
the pressing actuators comprise a plurality of airbags configured to apply a pressing force to the substrate, and the airbags are connected to a plurality of fluid supply lines
Implementation Method 2
the pressing actuators comprise a plurality of piezoelectric elements configured to apply a pressing force to the substrate, and the piezoelectric elements are connected to a plurality of control lines for controlling operations of the piezoelectric elements
Implementation Method 3
a polishing structure having a polishing surface, the polishing structure comprising a scrolling polishing table configured to move in translation along a circular path
Implementation Method 4
a polishing belt configured to move linearly along a traveling direction
Implementation Method 5
The film formed on the wafer is polished by a combination of mechanical action caused by abrasive grains contained in the polishing liquid or the polishing pad
Implementation Method 6
The film formed on the wafer is polished by a combination of mechanical action caused by abrasive grains contained in the polishing liquid or the polishing pad, and chemical action caused by chemical components of the polishing liquid
Data Source
AI summary
A polishing apparatus capable of accurately controlling a film thickness profile of a substrate by controlling each of a plurality of pressing actuators without having a complicated mechanism is disclosed. The polishing apparatus includes a polishing structure, a polishing head, and a head rotation mechanism configured to rotate the polishing head within a predetermined rotation angle range. The polishing head includes a plurality of pressing actuators. The polishing structure includes a polishing table or a polishing belt.