Polishing Liquid Removal via Jetting and Suction
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Solution Overview
Problem
Current CMP processes face inefficiencies in reducing slurry usage and effectively removing used polishing liquid, leading to increased costs and potential quality issues due to complex configurations and high suction requirements.
Innovation Solution
The apparatus includes a polishing table with a rotatable polishing pad, a substrate holding unit, and a polishing-liquid removing unit with a cleaning unit that jets cleaning liquid onto the polishing surface and a sucking unit to collect the liquid, featuring a damming unit and a sucking unit with a slit for efficient liquid removal, and a temperature adjusting unit that maintains optimal surface temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polishing liquid is supplied in large amounts to ensure adequate polishing performance, then polishing quality is maintained, but operational cost increases and environmental impact worsens
Solution Approach 1:
The patent implements a system that recovers used polishing liquid through a collecting unit and returns it to the polishing surface via a supplying unit. The used liquid is collected in a container, filtered through a filter unit, and reused, thereby reducing polishing liquid consumption while maintaining polishing quality.
Solution Approach 2:
The patent employs a sensor unit to detect the state of the polishing surface and the amount of polishing liquid present. This feedback information is used to control the supplying unit to adjust the amount of liquid supplied, optimizing the balance between polishing quality and liquid consumption.
2Loss of substance
If complex configurations are used to reduce slurry usage (e.g., retainers, housing recesses), then polishing liquid consumption decreases, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into the polishing table structure. The collecting unit, filter unit, supplying unit, and sensor unit are integrated into the polishing table, allowing it to simultaneously perform polishing, liquid collection, filtration, supply control, and sensing functions, thereby reducing overall device complexity.
Solution Approach 2:
The system uses the rotation of the polishing table itself to facilitate liquid collection and processing. The collecting unit leverages the rotational motion to gather used liquid, and the sensor unit continuously monitors the polishing surface state to automatically adjust supply, making the system self-regulating without complex external control mechanisms.
3Productivity
If suction force is increased to effectively remove used polishing liquid, then liquid removal efficiency improves, but energy consumption increases
Solution Approach 1:
The patent introduces a filter unit as an intermediary between the collecting unit and the supplying unit. The filter unit processes the used polishing liquid, removing contaminants while maintaining the liquid's properties, thereby enabling effective reuse without requiring excessive suction force to handle contaminated liquid.
Solution Approach 2:
The system continuously recovers and reuses polishing liquid through an ongoing cycle of collection, filtration, and supply. This continuous process maintains optimal polishing conditions without the need for high suction forces to remove all used liquid, as the system proactively manages liquid levels and composition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces slurry usage, improves polishing quality by maintaining optimal surface temperature, and enhances the efficiency of polishing liquid removal, reducing operational costs and environmental impact.
Implementation Method 1
a cleaning unit configured to jet cleaning liquid onto a polishing surface
Implementation Method 2
a sucking unit configured to remove polishing liquid from the polishing surface
Implementation Method 3
a pressing mechanism configured to press the supplying device against the polishing pad
Implementation Method 4
the polishing table and the substrate holding mechanism are rotated, whereby the substrate comes into sliding contact with the polishing surface
Data Source
AI summary
There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.