Polishing and Loading Module for Wafer Transfer Efficiency

Solution Overview

Problem

Existing CMP equipment has low wafer transfer efficiency and a complex transfer mechanism, which hinders the productivity and space efficiency in semiconductor integrated circuit manufacturing.

Innovation Solution

A polishing and loading/unloading component module with a movable loading/unloading table that can move between two positions, simplifying the device structure and enabling parallel operation of multiple polishing modules, reducing the need for back-and-forth movement of polishing heads for cleaning, and allowing for flexible expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a linear arrangement of polishing units is adopted with a loading/unloading table, then the equipment can process multiple wafers simultaneously, but the wafer transfer efficiency is low because each polishing unit is equipped with two transfer stations yet only loads and unloads from one during polishing

Engineering Contradiction:

Improvewafer transfer efficiencyVSAvoidtransfer mechanism complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The equipment is divided into multiple independent polishing units (first polishing unit, second polishing unit, third polishing unit, fourth polishing unit), each with its own loading/unloading table. This segmentation allows each unit to operate independently with dedicated transfer stations, eliminating the bottleneck where units shared transfer stations and reducing overall transfer time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single linear transfer mechanism to a multi-dimensional arrangement where loading/unloading tables are positioned at different locations relative to polishing units. The first and second loading/unloading tables are arranged in a first direction, while the third and fourth are arranged in a second direction, creating spatial independence that enables parallel wafer transfer operations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If four polishing units are arranged side by side in a linear fashion, then the equipment layout is simple, but the overall polishing throughput is limited due to the complex transfer mechanism required to service all units

Engineering Contradiction:

Improvepolishing throughputVSAvoidtransfer mechanism complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The equipment is divided into multiple independent polishing units (first polishing unit, second polishing unit, third polishing unit, fourth polishing unit), each with its own loading/unloading table. This segmentation allows each unit to operate independently with dedicated transfer stations, eliminating the bottleneck where units shared transfer stations and reducing overall transfer time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single linear transfer mechanism to a multi-dimensional arrangement where loading/unloading tables are positioned at different locations relative to polishing units. The first and second loading/unloading tables are arranged in a first direction, while the third and fourth are arranged in a second direction, creating spatial independence that enables parallel wafer transfer operations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If a square layout with one loading/unloading station serving three polishing units is used, then the equipment occupies less space, but the process becomes complicated and transfer efficiency decreases

Engineering Contradiction:

Improveequipment space occupationVSAvoidwafer transfer efficiency

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

The equipment is divided into multiple independent polishing units (first polishing unit, second polishing unit, third polishing unit, fourth polishing unit), each with its own loading/unloading table. This segmentation allows each unit to operate independently with dedicated transfer stations, eliminating the bottleneck where units shared transfer stations and reducing overall transfer time.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single linear transfer mechanism to a multi-dimensional arrangement where loading/unloading tables are positioned at different locations relative to polishing units. The first and second loading/unloading tables are arranged in a first direction, while the third and fourth are arranged in a second direction, creating spatial independence that enables parallel wafer transfer operations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12194592B2Polishing and loading/unloading component module

Publication Date: 2025.01.14 HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD

AI summary

A polishing and loading/unloading component module comprises a loading/unloading module in the center and two polishing modules on both sides of the loading/unloading module. The loading/unloading module includes a loading/unloading table module which has two loading/unloading positions in a direction perpendicular to the arrangement direction of the two polishing modules. The loading/unloading table module can move back and forth between the two loading/unloading positions, or the two loading/unloading positions are provided with loading/unloading table modules apiece, corresponding to the two polishing modules respectively.