Polishing Membrane Deformation for Substrate Release
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Solution Overview
Problem
Existing polishing apparatuses face challenges in efficiently separating substrates from polishing membranes without causing damage, as the pressure applied for polishing can lead to strong adhesion, making substrate release difficult and potentially damaging.
Innovation Solution
The polishing apparatus employs a membrane with air tubes or hard materials that deform into an uneven surface upon pressure change, reducing adhesion with the substrate and facilitating easy separation by forming convex portions without direct contact, ensuring uniform deformation and avoiding substrate damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pressure is applied to the membrane to press the substrate against the polishing surface, then polishing effectiveness is improved, but adhesion between the substrate and membrane increases making separation difficult
Solution Approach 1:
The membrane is designed to dynamically change its surface topology from flat during polishing to uneven during separation. By applying pressure in a specific direction after polishing, the membrane deforms into an uneven surface with convex portions that reduce adhesion, enabling easy substrate release without damaging the substrate.
Solution Approach 2:
The membrane's surface geometry parameter changes from flat to uneven through controlled pressure application. This parameter change transforms the interaction between the membrane and substrate, reducing adhesion forces and facilitating separation while maintaining polishing effectiveness during the polishing phase.
2Ease of operation
If pressure is applied to separate the substrate from the membrane, then substrate release is achieved, but substrate damage may occur
Solution Approach 1:
The membrane dynamically transitions to an uneven surface configuration during separation, where convex portions are formed that do not directly contact the substrate. This dynamic change allows force application for separation while avoiding concentrated stress points that would damage the substrate.
Solution Approach 2:
The uneven surface configuration of the membrane acts as an intermediary mechanism between the separation force and the substrate. The convex portions distribute the separation force across multiple points without direct contact, serving as a mediator that enables release while protecting the substrate from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for efficient and damage-free separation of substrates from the polishing apparatus, ensuring effective release without compromising the substrate's integrity, as the deformation of the membrane surface reduces adhesion and prevents direct contact with the substrate.
Implementation Method 1
The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane
Data Source
AI summary
A polishing apparatus according to an embodiment includes a polishing pad including a polishing surface for polishing a polishing target object and a membrane including a contact surface that is in contact with the polishing target object on the opposite side of the polishing surface. The contact surface is deformed from a flat surface into an uneven surface in response to pressure applied to the membrane.