Polishing Pad Adhesive Sheet for Slurry Resistance and Clean Removal

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing double-sided adhesive sheets for polishing cloths in semiconductor wafer and LCD glass substrate polishing face challenges with displacement or peeling due to high temperatures and exposure to strongly acidic or alkaline slurry, and removal often leaves adhesive residue.

Innovation Solution

An adhesive sheet with a specific composition of a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, combined with tackifier resins of varying hydroxy values, enhances shear strength, slurry resistance, and removability without residue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high adhesion is imparted to the adhesive layer by addition of a tackifier resin to prevent displacement or peeling, then resistance to displacement or peeling under shear force and chemical exposure is improved, but removability deteriorates as adhesive residue remains on the surface plate

Engineering Contradiction:
Improveresistance to displacement or peelingVSAvoidremovability without adhesive residue
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent applies parameter changes by precisely controlling the hydroxy value parameter of the tackifier resin within a specific range (5-50 mgKOH/g) and optimizing its composition ratio relative to the base polymer (5-50 parts by weight per 100 parts of base polymer). This parameter optimization resolves the contradiction by achieving the right balance between adhesion strength for resistance and controlled removability without residue.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by formulating an adhesive layer that combines a base polymer with a specifically selected tackifier resin having controlled hydroxy value. This composite adhesive system achieves both high resistance to displacement/peeling under shear force and chemical exposure, and proper removability without leaving residue on the surface plate.

Inventive Principle:
Principle #40Composite materials

2Productivity

If the adhesive layer is exposed to high temperature and strongly acidic or alkaline slurry during polishing, then the polishing process can be performed, but the adhesive layer deteriorates and displacement or peeling occurs

Engineering Contradiction:
Improvepolishing process capabilityVSAvoidadhesive layer stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies parameter changes by selecting and controlling the hydroxy value parameter of the tackifier resin (5-50 mgKOH/g) and its composition ratio, which enhances the adhesive layer's chemical resistance and thermal stability. This allows the adhesive to withstand high temperature and strongly acidic or alkaline slurry conditions during polishing while maintaining reliability and preventing displacement or peeling.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The adhesive sheet maintains high shear strength and slurry resistance at elevated temperatures while ensuring easy removal without adhesive residue, suitable for polishing processes.

Implementation Method 1

a double-sided adhesive sheet is usually used to fix the polishing cloth to the surface plate

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

during polishing, the temperature rises due to frictional heat or a strong shear force is applied

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12583076B2Adhesive sheet and polishing pad with adhesive sheet
Publication Date: 2026.03.24 SEKISUI CHEMICAL CO LTD
  • US12583076B2 patent drawing

AI summary

The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including at least one adhesive layer, the adhesive layer containing a base polymer, a tackifier resin (T1) having a hydroxy value of less than 20 mgKOH/g, and a tackifier resin (T2) having a hydroxy value of 20 mgKOH/g or more and 120 mgKOH/g or less, the base polymer being a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and the adhesive layer containing the tackifier resin (T1) in an amount of 10 parts by weight or more and 60 parts by weight or less relative to 100 parts by weight of the base polymer, and the tackifier resin (T2) in an amount of 1 part by weight or more and 40 parts by weight or less relative to 100 parts by weight of the base polymer.