Polishing Pad Adsorption Layer Surface Roughness Control
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Solution Overview
Problem
The existing polishing methods using adsorption layers on polishing pads for semiconductor wafers and similar components face unpredictable scratching and roughening of the polished surface, leading to deterioration in polishing accuracy, despite the efficiency and accuracy enhancements provided by these pads.
Innovation Solution
A polishing method where the surface roughness of the surface plate is regulated to a specific range (0.01 to 0.7 μm) to improve the fixed state of the polishing pad, using a composition of crosslinked silicones for the adsorption layer and a polishing pad with a base material to ensure stable and high-quality polishing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a polishing pad with an adsorption layer is used to improve polishing efficiency and accuracy, then polishing productivity and surface flatness are enhanced, but unpredictable scratching and roughening of the polished surface occurs, leading to deterioration of polishing accuracy
Solution Approach 1:
The invention changes the physical parameter of surface roughness of the surface plate to a specific range (0.01 to 0.7 μm) to optimize the adsorption characteristics between the polishing pad and surface plate. This parameter adjustment ensures stable adsorption fixation while preventing unpredictable scratching and roughening of the polished surface, thereby resolving the contradiction between polishing efficiency and accuracy.
2Strength
If adhesive fixation with pressure-sensitive adhesive is used to firmly fix the polishing pad, then the polishing pad is firmly fixed, but much time and labor are required for replacing the polishing pad, reducing working efficiency
Solution Approach 1:
The invention replaces the chemical adhesive fixation system with a physical adsorption system. The adsorption layer on the polishing pad back surface adsorbs to the surface plate through physical adsorption forces, achieving firm fixation without requiring pressure-sensitive adhesives. This substitution enables easy and quick replacement of the polishing pad, significantly improving working efficiency while maintaining adequate fixation strength.
3Duration of action of stationary object
If the polishing pad is frequently replaced due to wear, then continuous polishing of a large number of semiconductor wafers is enabled, but the replacement process consumes time and labor, reducing overall productivity
Solution Approach 1:
By replacing adhesive fixation with adsorption fixation, the invention enables rapid replacement of worn polishing pads. The adsorption layer allows the polishing pad to be easily detached and reattached without complex procedures, minimizing downtime during replacements and maintaining high overall productivity despite frequent pad changes required for continuous wafer polishing.
Solution Approach 2:
The adsorption layer provides self-fixing and self-releasing characteristics, allowing the polishing pad to be easily attached and detached without additional tools or complex procedures. This self-service feature streamlines the replacement process, reducing the time and labor required for maintenance operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method maintains high polishing accuracy and efficiency by ensuring a stable fixed state of the polishing pad, preventing defects and peeling, and allowing for continuous high-quality polishing even with wear and replacement of the pad.
Implementation Method 1
an adsorption layer having a specific configuration is provided on a back surface of a polishing layer... the adsorption layer here is intended to fix the polishing pad to the surface plate by the adsorption action of the adsorption layer
Implementation Method 2
an adsorption layer including a composition obtained by crosslinking at least one silicone selected from a silicone including linear polyorganosiloxane having vinyl groups only at both ends
Implementation Method 3
the adsorption layer including a composition obtained by crosslinking at least one silicone... for adsorbing and fixing the polishing pad to the surface plate
Data Source
AI summary
A polishing method using a polishing pad including a specific adsorption layer. The polishing pad has an adsorption layer including a silicone including linear polyorganosiloxane having vinyl groups only at both ends, and the like. The polishing pad is fixed to a surface plate, and a product to be polished is pressed against the polishing pad, and simultaneously slid to polish the product to be polished. In this case, the surface roughness (Ra) of the surface plate is set to 0.01 to 0.7 μm, and the adsorption layer of the polishing pad is then adsorbed and fixed to the surface plate to perform polishing work. By adjusting the surface roughness of the surface plate as described above, a surface of the product to be polished can be inhibited from being unpredictably scratched or roughened. The method for adjusting the surface roughness of the surface plate is preferably a method in which a film having a surface roughness as described above is bonded to a surface of the surface plate.