Leakage-Proof Polishing Pad With Compressed Support Layer

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Solution Overview

Problem

Existing polishing pads for the CMP process suffer from leakage issues due to gaps between the polishing layer and the window block, which compromises the airtightness and leads to slurry leakage during the process.

Innovation Solution

A polishing pad design featuring a polishing layer with a first penetrating hole, a support layer with compressed regions under the polishing layer, and a window inserted into the hole, where the support layer has a first compressed region around the outer peripheral region and a second compressed region around the inner peripheral region of the window, enhancing airtightness without the need for a separate leakage-proof layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a window block is inserted into the polishing layer to enable optical detection, then the ability to detect wafer thickness is improved, but leakage occurs due to gaps between the polishing layer and window block

Engineering Contradiction:
Improvewafer thickness detectionVSAvoidairtightness
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The support layer is compressed selectively in specific regions (first compressed region at outer periphery and second compressed region at inner periphery of the window) to create localized high-density zones that seal gaps between the window and polishing layer, while other regions maintain their original properties for polishing functionality

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The support layer undergoes compression to change its density parameter, creating compressed regions with higher density that effectively seal the interface between the window and polishing layer, preventing slurry leakage while maintaining optical detection capability

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the support layer is compressed to form a low-porosity region, then airtightness is improved, but the structural complexity increases

Engineering Contradiction:
ImproveairtightnessVSAvoidsupport layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The support layer compression is segmented into distinct regions (first compressed region and second compressed region) with different compression zones, allowing targeted sealing at critical interfaces while maintaining simplicity in other areas

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents slurry leakage by creating a low-porosity interface between the polishing layer and the window, ensuring excellent airtightness and maintaining a uniform polishing rate, which is industrially applicable and enhances the accuracy of optically detecting the termination point.

Implementation Method 1

the compressed region has been compressed by heat and/or pressure to have a low porosity

Methodology Applied
Scientific EffectCompression: Compression

Data Source

PatentUS11267098B2Leakage-proof polishing pad and process for preparing the same
Publication Date: 2022.03.08 SK ENPULSE CO LTD
  • US11267098B2 patent drawing
  • US11267098B2 patent drawing
  • US11267098B2 patent drawing

AI summary

Embodiments relate to a leakage-proof polishing pad for use in a chemical mechanical planarization (CMP) process and a process for producing the same.