Polishing Pad Deep-Groove Land Region Break-In Time

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Solution Overview

Problem

Conventional polishing pads require extended break-in times due to difficulties in achieving the necessary surface roughness for effective polishing, especially when using non-foamed polymer bodies with high hardness, which complicates the manufacturing process and increases production costs.

Innovation Solution

A polishing pad with a deep-groove region and a land region featuring shallow recesses and island-like land portions, allowing for efficient conditioning and reducing break-in time through enhanced contact points with the pad conditioner, formed using a thermoplastic polyurethane non-foamed polymer body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a non-foamed polymer body with high hardness is used for the polishing pad to achieve high planarization performance and long life, then planarization performance and abrasion resistance are improved, but the break-in time is significantly extended due to difficulty in achieving suitable surface roughness

Engineering Contradiction:
Improveplanarization performanceVSAvoidbreak-in time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The polishing pad surface is pre-formed with a specific roughness pattern (peaks and valleys) during the manufacturing process, before the pad is actually used for polishing. This preliminary structuring of the surface eliminates the need for extended break-in conditioning, as the suitable roughness is already present when the pad is installed

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The surface morphology parameters of the polishing pad are controlled during manufacturing to create a specific roughness profile (with peaks having Rpk of 0.003 to 0.03 mm and valleys having Rvk of 0.007 to 0.03 mm). By adjusting these surface parameters in advance, the pad achieves optimal polishing performance immediately without requiring time-consuming break-in conditioning

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the hardness of the polishing layer is increased to improve planarization performance, then planarization performance is improved, but it becomes difficult to achieve further increases in planarization performance and the break-in time increases

Engineering Contradiction:
Improveplanarization performanceVSAvoiddifficulty in achieving suitable roughness
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The polishing pad is structured into distinct peak regions and valley regions on the surface, creating a segmented topography. This segmentation allows different portions of the surface to serve different functions: peaks provide contact points for polishing while valleys provide slurry retention, achieving suitable roughness characteristics without requiring extreme hardness increases

Inventive Principle:
Principle #1Segmentation

3Ease of operation

If a non-woven fabric-type polishing pad is used to achieve good contact with the base material, then flexibility and contact quality are improved, but planarization performance deteriorates due to the flexibility of the material

Engineering Contradiction:
Improvecontact qualityVSAvoidplanarization performance
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The polishing pad is constructed as a composite structure combining a non-woven fabric substrate (providing flexibility and contact quality) with a hardened polishing layer having controlled surface roughness (providing planarization performance). This composite construction allows both flexibility for good contact and sufficient hardness for effective planarization

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12186855B2Polishing pad, method for manufacturing polishing pad, and polishing method
Publication Date: 2025.01.07 KURARAY CO LTD
  • US12186855B2 patent drawing
  • US12186855B2 patent drawing
  • US12186855B2 patent drawing

AI summary

Disclosed is a polishing pad including a polishing layer having a polishing surface, wherein the polishing surface includes a deep-groove region having a first pattern formed by a deep groove or hole having a depth of 0.3 mm or more, and a land region that is a region other than the deep-groove region, and the land region includes shallow recesses having a second pattern and a depth of 0.01 to 0.1 mm, and a plurality of island-like land portions surrounded by the shallow recesses and having a maximum distance in a horizontal direction of 8 mm or less.