Polishing Pad Shape Control via Automated Dressing Position
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Solution Overview
Problem
Conventional polishing pad shaping and conditioning processes in semiconductor manufacturing are manual, time-consuming, and interruptive, leading to reduced throughput and efficiency in polishing operations.
Innovation Solution
A polishing apparatus equipped with automated pad shape measurement, dressing control, and type detection systems, which automatically adjusts and maintains the polishing pad to a predetermined shape and optimizes polishing conditions based on real-time data, minimizing interruptions and improving overall process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual operation is used for polishing pad shape adjustment, then the operator can adjust the polishing pad shape based on experience, but the throughput of polishing steps is reduced and time is consumed
Solution Approach 1:
The polishing pad shape adjustment system performs self-measurement and self-adjustment without requiring manual intervention. The measurement unit automatically measures the polishing pad shape, and the control unit automatically adjusts the dresser position based on the measured data, eliminating the need for operator involvement and thereby increasing throughput while maintaining precision
Solution Approach 2:
The manual mechanical adjustment operation is replaced by an automated measurement and control system. The measurement unit (optical or contact-type) and control unit work together to automatically determine and execute the optimal dresser position, substituting the operator's manual mechanical adjustment with an automated system that increases productivity
2Shape
If manual operation is used for polishing pad dressing, then the operator can adjust the polishing pad to predetermined shape, but interruptions occur in polishing steps reducing overall efficiency
Solution Approach 1:
The polishing pad shape adjustment is performed continuously during the polishing steps without interrupting the polishing process. The measurement unit measures the polishing pad shape between polishing operations, and the control unit adjusts the dresser position automatically, ensuring continuous useful action and eliminating time losses due to interruptions
Solution Approach 2:
The polishing pad shape measurement and adjustment are performed in advance before the polishing steps commence. The measurement unit measures the polishing pad shape, and the control unit pre-adjusts the dresser position to the optimal setting, ensuring that the polishing steps can proceed without interruptions for shape adjustment
3Adaptability or versatility
If operator manually determines polishing pad type and sets conditions, then the polishing conditions can be individually adjusted, but the throughput is reduced due to manual judgment time
Solution Approach 1:
The measurement unit provides feedback data on the polishing pad shape and characteristics to the control unit. The control unit uses this feedback information to automatically determine the polishing pad type and set the appropriate polishing conditions, eliminating the need for manual operator judgment and thereby increasing throughput while maintaining adaptability
Solution Approach 2:
The operator's manual judgment and decision-making process is replaced by an automated measurement and control system. The measurement unit detects polishing pad characteristics, and the control unit automatically selects and sets the appropriate polishing conditions based on the detected type, substituting manual cognitive processes with automated sensing and control that increases productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The automated system significantly enhances the throughput of polishing steps by reducing manual intervention and optimizing polishing conditions, leading to improved consistency and reduced costs in semiconductor device manufacturing.
Implementation Method 1
pad shape measurement means (for example, pad shape measurement instrument 20 of the embodiments) for measuring the shape of the polishing pad mounted on the polishing tool
Implementation Method 2
a dresser for dressing the polishing pad by bringing the rotated dressing surface thereof into contact with the surface of the polishing pad mounted on the polishing tool
Data Source
AI summary
While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaft 11 of a polishing pad 13 and a rotating shaft 31 of a dresser 30 and shape change of the polishing pad 13 based on input of a target shape of the polishing pad 13 and alternating repetition of dressing the polishing pad 13 by the dresser 30 and measurement of shape of the polishing pad 13 by a pad shape measurement instrument 20 is acquired at a stage prior to commencement of a series of polishing steps for continuously polishing a plurality of polishing target objects (semiconductor wafer W) by a polishing tool 10, the polishing pad 13 is machined to the target shape 13 while the dressing position P is controlled, whereby the dressing position P is set during the polishing steps on the basis of a processing result of this data.