3D Printed Polishing Pad with Embedded Abrasives
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Solution Overview
Problem
The existing chemical mechanical polishing (CMP) processes face challenges in achieving uniform conditioning of polishing surfaces due to indiscriminate cutting actions and non-uniform properties of polishing media, leading to reduced media life and substrate defects.
Innovation Solution
A polishing article manufacturing system that includes a composite pad body with polishing features formed from a first material and base features from a second material, where the first material has a higher hardness than the second material, and a 3D printing process to embed abrasives in specific locations within the polishing layer, ensuring controlled surface roughness and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conditioning disk with abrasives is used to roughen the polishing surface, then the removal rate is improved, but the surface roughness becomes non-uniform and media life is shortened
Solution Approach 1:
The polishing article incorporates discrete abrasive features distributed across the polishing surface, where each abrasive feature provides localized roughening action. This creates zones of different abrasive concentration and hardness throughout the polishing article, enabling uniform conditioning across the entire substrate surface while maintaining consistent removal rates.
Solution Approach 2:
The invention varies the hardness parameter by using a polymeric material with specific durometer range (40-90 Shore A) and controls abrasive particle size (0.1-10 micrometers) and distribution density. These parameter changes enable precise control over the conditioning action, achieving uniform surface roughness while maintaining effective removal rates.
2Productivity
If the polishing surface is roughened to restore removal rate, then film removal rate is improved, but substrate defects increase due to pad debris and broken asperities
Solution Approach 1:
The polishing article utilizes a porous polymeric matrix that traps and holds abrasive particles within its structure. This porous configuration prevents abrasive particles from breaking loose during polishing, eliminating pad debris that would otherwise cause substrate defects. The abrasive particles remain securely embedded while still providing effective roughening action to maintain removal rates.
Solution Approach 2:
The invention creates a composite structure combining a polymeric matrix material with embedded abrasive particles. This composite design integrates the benefits of both materials: the polymer provides flexibility and particle retention, while the abrasives provide controlled roughening action. The composite structure prevents particle detachment and substrate contamination while maintaining high removal rates.
3Productivity
If the polishing media properties are made non-uniform to provide aggressive conditioning in some areas, then local polishing performance is improved, but overall uniformity across the substrate is reduced
Solution Approach 1:
The polishing article incorporates discrete abrasive features distributed across the polishing surface, where each abrasive feature provides localized roughening action. This creates zones of different abrasive concentration and hardness throughout the polishing article, enabling uniform conditioning across the entire substrate surface while maintaining consistent removal rates.
Solution Approach 2:
The invention distributes abrasive features uniformly across the polishing surface in a pattern that ensures equivalent conditioning action at all locations. By spacing abrasive features at consistent intervals and using uniform particle sizes, the system achieves equipotential conditioning where every area of the substrate receives comparable roughening treatment, resulting in overall uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the uniformity and longevity of the polishing process, reducing substrate defects by maintaining consistent surface roughness and improving film removal rates through controlled abrasive distribution and hardness variation.
Implementation Method 1
The conditioning disk is rotated and pressed against the surface of the media and mechanically cuts the surface of the polishing media
Implementation Method 2
A three-dimensional (3D) printing process may be used to form the patterned surface
Implementation Method 3
The curing section may include one or both of a thermal curing device and an electromagnetic curing device
Implementation Method 4
The curing section may include one or both of a thermal curing device and an electromagnetic curing device
Data Source
AI summary
A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.