Polishing Pad with Hook-and-Loop Molding for Layer Strength
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Solution Overview
Problem
Conventional polishing pads fail to withstand high stress, load, and wear during the polishing process due to inadequate gluing connections between layers, leading to frequent replacements and increased user expenses.
Innovation Solution
The polishing pad layers are attached via a molding process using semi-rigid polyurethane with microcells, and a hook-and-loop fastener system, ensuring a strong and durable connection between the damping, adhesive, and polishing layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional gluing methods are used to attach polishing pad layers, then manufacturing simplicity is maintained, but connection strength and durability deteriorate under high stress and wear
Solution Approach 1:
The patent replaces the chemical gluing process with a mechanical molding process. The layers are mechanically interlocked through a molding operation that creates integrated connections, eliminating reliance on adhesive chemistry and providing superior mechanical strength under stress and wear conditions.
Solution Approach 2:
The patent uses composite construction with multiple layers (polishing layer, damping layer, adhesive layer) that are mechanically integrated through molding. This composite structure with interlocked layers provides enhanced durability and resistance to separation under high stress and wear during polishing operations.
2Duration of action of stationary object
If polishing pads are designed for high durability, then replacement frequency decreases, but initial manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines multiple manufacturing operations into a single molding process. The layers are attached and integrated in one mechanical molding operation rather than through separate gluing and drying steps, achieving high durability while maintaining manufacturing efficiency and reducing process complexity.
3Strength
If foam material with air bubbles is used for damping layer, then cushioning effect is achieved, but gluing surface area is reduced leading to weaker connections
Solution Approach 1:
The patent replaces chemical adhesion with mechanical interlocking through molding. The damping layer with its foam structure and air bubbles is mechanically integrated with adjacent layers through the molding process, eliminating the problem of reduced gluing surface area while maintaining the cushioning effect of the foam structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved resistance to stress, load, and wear, extending the lifespan of the polishing pad and reducing replacement frequency, while maintaining effective polishing performance.
Implementation Method 1
a damping layer made of a resilient material, in particular of an expanded polyurethane material with sponge-like characteristics
Implementation Method 2
The resilient material is polyurethane, preferably a semi-rigid polyurethane with microcells
Implementation Method 3
an adhesive layer for connecting to a corresponding layer located at a bottom surface of the working element of the machine tool, in particular a layer of a hook-and-loop fastener
Data Source
AI summary
A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.