Polishing Pad Metal-Containing Layer Heat Dissipation
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Solution Overview
Problem
Conventional polishing pads experience poor heat dissipation during the polishing process, leading to increased temperatures that affect the stability and efficiency of the polishing process.
Innovation Solution
A polishing pad with a metal-containing layer disposed on the backside surface, which fills into cavities and has a contact area larger than the orthogonal projection area of the polishing layer, enhancing heat conduction to the external environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional polishing pad is used, then the polishing process can be performed, but the heat dissipation efficiency is poor causing temperature to rise excessively
Solution Approach 1:
The polishing pad combines a polishing layer with a metal-containing layer to create a composite structure. The metal-containing layer (with materials like aluminum, copper, or nickel) provides superior thermal conductivity compared to conventional single-material pads, enabling efficient heat dissipation while maintaining polishing functionality.
Solution Approach 2:
The invention introduces cavities on the backside surface of the polishing layer, creating a three-dimensional heat dissipation pathway. The metal-containing layer fills these cavities and extends beyond the orthogonal projection area, establishing additional heat conduction routes that increase the effective heat dissipation surface area.
2Temperature
If the polishing pad structure is modified to improve heat dissipation, then temperature control improves, but the device structure becomes more complex
Solution Approach 1:
The polishing pad is segmented into distinct functional layers: a polishing layer for material removal and a metal-containing layer for heat dissipation. The backside surface is further segmented with cavities that are selectively filled with metal material, creating zones of enhanced thermal conductivity where needed.
Solution Approach 2:
Rather than making the entire polishing pad uniformly complex, the metal-containing layer is strategically placed in cavities and extended regions where heat dissipation is most needed. This localized enhancement provides improved thermal management without unnecessarily complicating the entire pad structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the temperature rise of the polishing pad, maintaining process stability and preventing defects caused by high temperatures.
Implementation Method 1
heat generated by the friction during the polishing process can be efficiently conducted to the external environment through the metal-containing layer
Implementation Method 2
the polishing pad generates heat due to friction
Data Source
AI summary
A polishing pad is provided. The polishing pad comprises a polishing layer and a metal-containing layer. The polishing layer has a polishing surface and a backside surface opposite to each other, wherein the backside surface has a plurality of cavities. The metal-containing layer is disposed on the backside surface of the polishing layer and fills into the cavities, wherein a first contact area is between the metal-containing layer and the backside surface of the polishing layer, and the first contact area is larger than the orthogonal projection area of the polishing layer.