Polishing Pad with Polypeptide Chains for CMP

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Solution Overview

Problem

Current chemical mechanical polish (CMP) processes face inefficiencies in removing excess conductive material from semiconductor substrates, often requiring mechanical force and abrasive chemicals that can damage the polishing pads and lead to defects.

Innovation Solution

The use of polishing pads with customizable polypeptide chains that attract and electrostatically hold abrasives, allowing for efficient removal of excess material without mechanical force, and an enzyme-based system for cleaning and surface renewal to maintain pad integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical force and abrasive chemicals are used in CMP processes, then material removal efficiency is improved, but polishing pad damage and defect generation increase

Engineering Contradiction:

Improvematerial removal efficiencyVSAvoidpolishing pad damage and defects

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical force with electrostatic force by using a polishing pad with electrostatically charged regions. These charged regions attract and hold abrasive particles, enabling material removal through electrostatic attraction rather than mechanical pressing. This substitution reduces polishing pad damage while maintaining material removal efficiency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the electrostatic charge parameter of the polishing pad by applying different electrostatic charges to different regions of the pad. This allows control over abrasive particle distribution and material removal rate without increasing mechanical force, thereby reducing pad damage and defect generation.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If abrasive chemicals are used to assist grinding, then material removal rate is improved, but chemical contamination and pad degradation increase

Engineering Contradiction:

Improvematerial removal rateVSAvoidchemical contamination and pad degradation

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces chemical assistance with electrostatic attraction. By charging the polishing pad electrostatically, abrasive particles are attracted and held in place without requiring chemical adhesives or slurry chemicals. This eliminates chemical contamination while maintaining material removal rate through electrostatic force.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The electrostatic field acts as an intermediary between the polishing pad and abrasive particles, replacing the need for chemical slurry. The electrostatic charge mediates the attachment of abrasives to the pad surface, enabling material removal without chemical contamination.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If traditional polishing pads are used, then initial polishing performance is good, but pad lifespan is limited due to wear and damage

Engineering Contradiction:

Improveinitial polishing performanceVSAvoidpad lifespan

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent replaces mechanical pressing with electrostatic attraction, significantly reducing mechanical stress on the polishing pad. This substitution maintains initial polishing performance through controlled electrostatic fields while extending pad lifespan by minimizing mechanical wear and damage.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent dynamically adjusts electrostatic charge parameters to optimize polishing performance at different stages of pad life. By controlling the electrostatic field strength and distribution, the system maintains consistent polishing quality even as the pad undergoes minimal wear, thereby extending usable pad lifespan.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the CMP process by improving material removal rates, reducing defects, and extending the lifespan of polishing pads through electrostatic attraction and enzymatic surface renewal, ensuring high fidelity and flexibility in abrasive usage.

Implementation Method 1

polishing pads with customizable polypeptide chains that attract and electrostatically hold abrasives

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

an enzyme-based system for cleaning and surface renewal to maintain pad integrity

Methodology Applied

Scientific EffectEnzymatic reaction: Enzyme

Data Source

PatentUS20240383096A1Polish Apparatus and Methods for Use

Publication Date: 2024.11.21 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A chemical mechanical polish apparatus and methods for manufacturing and use of the chemical mechanical polishing apparatus are discussed herein. In an embodiment, a polishing apparatus is provided that includes: a polishing pad coated with polypeptides; and an enzyme spraying device positioned adjacent to the polishing pad.