Polishing Pad Protrusions with Hard Surface and Elastic Core

Solution Overview

Problem

Chemical mechanical polishing processes in semiconductor manufacturing often result in surface imperfections and damage due to protrusions on polishing pads being too hard, which affects the quality and productivity of semiconductor devices.

Innovation Solution

A polishing pad with fine protruding portions, where the protruding portion is more elastic than the surface layer, allowing for increased polishing rate and flatness by using a base layer with a softer material and a surface layer with higher hardness, enabling effective polishing without causing scratches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the polishing pad uses hard protrusions to increase polishing rate, then the polishing efficiency is improved, but surface imperfections and damage occur on the semiconductor device

Engineering Contradiction:

Improvepolishing rateVSAvoidsurface flatness

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The polishing pad employs protrusions with non-uniform hardness distribution, where the core region has different hardness than the surface region. This local quality variation allows the protrusion tip to be hard enough for effective polishing while the base remains softer to prevent damage, resolving the contradiction between polishing rate and surface flatness

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The polishing pad uses composite material structure with multiple layers or regions of different hardness. The protrusions are formed with a hard outer layer for polishing efficiency and a softer inner layer for damage prevention, combining the benefits of both hard and soft materials to achieve high polishing rate without surface damage

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If the polishing pad uses soft material to prevent surface damage, then the semiconductor device quality is improved, but the polishing rate decreases

Engineering Contradiction:

Improvesurface qualityVSAvoidpolishing rate

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The polishing pad employs protrusions with non-uniform hardness distribution, where the core region has different hardness than the surface region. This local quality variation allows the protrusion tip to be hard enough for effective polishing while the base remains softer to prevent damage, resolving the contradiction between polishing rate and surface flatness

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The polishing pad uses composite material structure with multiple layers or regions of different hardness. The protrusions are formed with a hard outer layer for polishing efficiency and a softer inner layer for damage prevention, combining the benefits of both hard and soft materials to achieve high polishing rate without surface damage

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the polishing efficiency and flatness of semiconductor surfaces, preventing surface defects and improving the overall quality and productivity of semiconductor devices.

Implementation Method 1

the protruding portion is more elastic than the surface layer

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS20230219191A1Polishing pad, chemical mechanical polishing apparatus including the same, and method for manufacturing semiconductor device using the same

Publication Date: 2023.07.13 SAMSUNG ELECTRONICS CO LTD

AI summary

The present disclosure provides a polishing pad and a method of manufacturing a semiconductor device using the same. The method includes disposing a target layer on a semiconductor substrate and performing a chemical mechanical polishing process on the target layer using a polishing pad including a plurality of polishing protrusions facing the target layer. Each of the polishing protrusions includes a protruding portion and a surface layer at least partially covering the protruding portion, wherein the protruding portion is more elastic than the surface layer, and wherein the surface layer is harder than the protruding portion.