Polishing Pad Temperature Regulator with Segmented Baffles
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Solution Overview
Problem
Conventional polishing apparatuses struggle to rapidly increase the surface temperature of the polishing pad to the target temperature during substrate polishing, affecting the polishing rate and throughput in semiconductor device fabrication.
Innovation Solution
The polishing apparatus incorporates a pad temperature regulator with a pad contact element that includes a liquid supply system and a partitioned passage structure with baffles, allowing the temperature-controlled liquid to flow alternately with and against the rotating direction of the polishing pad, enhancing heat exchange efficiency and rapid temperature increase.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional pad contact element with a simple liquid passage is used, then the structure is simple, but the surface temperature of the polishing pad cannot be raised rapidly to the target temperature
Solution Approach 1:
The liquid passage is segmented into multiple passages (first liquid passage and second liquid passage) that are arranged in series. This segmentation allows the temperature-controlled liquid to flow through multiple paths, increasing the total heat exchange area with the polishing pad and enabling faster temperature rise.
Solution Approach 2:
Baffles substantially perpendicular to the radial direction are introduced into the liquid passages. These baffles create a three-dimensional flow pattern that forces the liquid to move in both radial and circumferential directions, maximizing contact between the liquid and polishing pad surface, thereby enhancing heat exchange efficiency and reducing the time to reach target temperature.
2Temperature
If the liquid passage is extended to increase heat exchange area, then temperature control improves, but the pressure loss increases
Solution Approach 1:
The passage-forming member is made of sintered SiC (silicon carbide), which has porous characteristics. This local porous structure allows the liquid to flow through the walls of the passage, creating additional flow paths and reducing pressure loss while maintaining effective heat exchange area.
Solution Approach 2:
The liquid passage is divided into multiple segments (first and second liquid passages) connected in series. This segmentation allows the total pressure loss to be distributed across multiple smaller pressure drops rather than one large pressure drop, reducing the overall pressure loss while maintaining the necessary heat exchange area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the surface temperature of the polishing pad to be raised to the target temperature more quickly, improving the substrate polishing process throughput.
Implementation Method 1
Liquid flows through the pad contact element 100, so that the surface temperature of the polishing pad 102 is regulated by heat exchange between the liquid and the polishing pad 102
Implementation Method 2
A temperature-controlled liquid is introduced into the pad contact element 100 through the liquid inlet 93, flows through the liquid passage 99
Data Source
AI summary
A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.