Polishing Pad Sheet Surface Profile for Durable Wet CMP
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Solution Overview
Problem
Current chemical mechanical planarization (CMP) processes in semiconductor manufacturing face challenges in achieving stable and efficient polishing with existing polishing pads, particularly in maintaining high durability and optimal interfacial properties between polishing layers and cushion layers, especially in wet environments and over extended periods.
Innovation Solution
A polishing pad sheet with specific surface roughness and compressibility values, and a polishing pad comprising a polishing layer and a cushion layer derived from this sheet, where the cushion layer exhibits an adhesive force of 8.00 kgf/25 mm or more, ensuring stable and efficient polishing with improved durability and interfacial adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing polishing pads are used in CMP processes, then polishing can be performed, but durability is insufficient and interfacial properties between polishing layer and cushion layer deteriorate over time especially in wet environments
Solution Approach 1:
The patent applies parameter changes by precisely controlling the surface roughness parameters (Sv/Sz ratio between 4.20-5.50) and compressibility (1.8-2.2 mm) of the cushion layer. These parameter optimizations enhance the cushion layer's ability to maintain stable interfacial properties with the polishing layer during extended wet polishing operations, directly improving durability and service life in wet environments
2Ease of operation
If polishing pad uses higher compressibility to improve cushioning, then polishing performance may improve, but interfacial adhesion between polishing layer and cushion layer deteriorates
Solution Approach 1:
The patent resolves this contradiction through optimized parameter selection: compressibility is controlled within 1.8-2.2 mm and surface roughness Sv/Sz ratio within 4.20-5.50. This parameter optimization ensures the cushion layer provides adequate cushioning for polishing performance while maintaining strong interfacial adhesion to the polishing layer, preventing delamination during operation
Solution Approach 2:
The patent employs composite material structure by combining the cushion layer with the polishing layer in a laminated configuration. The cushion layer uses specific material composition (cellular structure with controlled density) that provides both cushioning properties and compatible interfacial adhesion to the polishing layer, resolving the trade-off between softness and bonding strength
3Productivity
If polishing process is extended for high productivity, then more material can be processed, but polishing flatness and quality deteriorate due to pad degradation
Solution Approach 1:
The patent applies beforehand cushioning by designing a cushion layer with optimized compressibility (1.8-2.2 mm) and surface roughness characteristics before the polishing process begins. This pre-optimized cushion layer maintains stable mechanical properties throughout extended polishing operations, providing consistent cushioning that preserves polishing flatness and quality even during high-productivity extended processing
Solution Approach 2:
The patent uses parameter changes by controlling the cushion layer's compressibility within 1.8-2.2 mm and Sv/Sz ratio within 4.20-5.50. These parameter specifications ensure the cushion layer maintains stable performance characteristics during extended polishing operations, preventing degradation that would compromise polishing flatness while enabling high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a stable polishing process with enhanced durability and interfacial properties, maintaining optimal polishing performance and preventing defects, even in wet environments for extended periods, while achieving high process efficiency and excellent polishing flatness.
Implementation Method 1
a cushion layer, wherein the cushion layer has a compressibility of 1.8 to 2.2 mm
Implementation Method 2
an adhesive layer, wherein the adhesive layer has an adhesive force of 8.00 kgf/25 mm or more
Implementation Method 3
A polishing pad which is used in such a CMP process is a component for a process of processing a polishing surface to a required level through friction
Data Source
AI summary
A polishing pad sheet which provides optimized interfacial properties for the laminated structure of a polishing pad based on appropriate elasticity and high durability, and in which the polishing pad having the polishing pad sheet applied thereto not only has its intrinsic function such as the polishing rate or the like, but also is capable of realizing the function without damage even during the polishing process in a wet environment for a long time, and a polishing pad to which the polishing pad sheet is applied. The polishing pad sheet includes: a first surface which is a polishing layer attachment surface; and a second surface which is a rear surface of the first surface, wherein the first surface has a value of the following Equation 1 of 4.20 to 5.50:4.20≤(|Sv|)/Sz×P (%)≤5.50.