Polishing Apparatus Simulator for Profile Control
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Solution Overview
Problem
Current polishing methods for semiconductor wafers face challenges in achieving precise control of polishing profiles without requiring numerous polishing tests and in reducing the consumption of costly polishing liquids, while maintaining a high polishing rate.
Innovation Solution
A polishing apparatus equipped with a simulator that predicts the relationship between the polishing liquid supply position and the polishing profile, allowing for efficient determination of movement patterns for the polishing liquid supply nozzle, and a film thickness monitor for real-time adjustments, reducing the need for extensive testing and minimizing polishing liquid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a top ring having a plurality of pressure chambers or air bags is used to independently apply pressures on multiple areas of a polishing object, then the polishing profile control is improved, but the device complexity increases and the ability to control smaller areas is limited
Solution Approach 1:
The polishing liquid supply area is segmented into multiple independent supply ports, each capable of supplying polishing liquid to different radial positions of the polishing object. This segmentation allows independent control of polishing rates in different areas without requiring complex pressure chamber structures, thus achieving precise polishing profile control while maintaining device simplicity.
Solution Approach 2:
Polishing liquid is used as an intermediary substance to transmit the polishing action from the stationary supply ports to different areas of the rotating polishing object. By controlling the position and flow of the polishing liquid, the system achieves area-specific polishing control without direct mechanical contact or complex pressure application mechanisms.
2Manufacturing precision
If the polishing liquid supply port is moved to control the polishing profile, then the precision of polishing control is improved, but the number of control parameters increases requiring many polishing tests
Solution Approach 1:
The system pre-establishes multiple polishing liquid supply ports at different radial positions before the polishing process begins. This preliminary configuration eliminates the need for dynamic movement and complex real-time control parameters, as the desired polishing profile can be achieved by simply activating the appropriate pre-positioned supply ports.
Solution Approach 2:
While the supply ports themselves are stationary, the system achieves dynamic control capability through the rotation of the polishing object, which brings different areas under the supply ports in sequence. This allows the stationary supply ports to effectively cover the entire polishing surface over time, providing flexible profile control without mechanical movement of the supply mechanism.
3Device complexity
If polishing liquid is supplied from a stationary supply port, then the device complexity is reduced, but the polishing rate and profile control precision deteriorate
Solution Approach 1:
The stationary supply mechanism is segmented into multiple supply ports positioned at different radial locations. Each port serves a specific annular region of the polishing object, enabling area-specific polishing control. This segmentation allows precise profile control while maintaining the simplicity of stationary supply ports.
Solution Approach 2:
The system utilizes the periodic rotation of the polishing object to bring different areas under the stationary supply ports in a repeating cycle. This periodic action ensures that all areas of the polishing object receive polishing liquid from the appropriate supply ports, achieving uniform and controllable polishing across the entire surface without requiring the supply ports to move.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control of polishing profiles with fewer tests and significantly reduces the consumption of polishing liquids, maintaining a high polishing rate and minimizing waste.
Implementation Method 1
a polishing liquid supply nozzle for supplying a polishing liquid to the polishing surface
Implementation Method 2
a simulator for predicting the relationship between the polishing liquid supply position of the polishing liquid supply nozzle and a polishing profile, performing a simulation and outputting data to the controller
Implementation Method 3
a film thickness monitor for real-time adjustments
Implementation Method 4
chemical mechanical polishing (CMP) with the use of a polishing liquid
Implementation Method 5
chemical mechanical polishing (CMP)
Data Source
AI summary
A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.